Abschlussbericht IRAS

Autor: Stäbler, Tina, Heck, Manuel, Hümbert, Simon, Marigo, Gloria, Müller, Ilja, Sakraker, Isil, Stindl, Torsten, Adamietz, Raphael, Echsel, Markus, Mielenz, Mathias, Springer, Patrick, Stuhlberg, Roman, Stuhler, Christoph, Weiss, Victor, Ehresmann, Manfred, Fugmann, Martin, Galla, Daniel, Lengowski, Michael, Skalden, Jonathan

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______1640::e4f5fe024580af827fa9f4771ebac848
https://elib.dlr.de/132567/

Verfahren zur Montage von Mikrochipgehäusen unter Einsatz von Mikrowellenhärtung

Autor: Adamietz, Raphael

Advanced electronic packaging continues to gain prevalence, driven by the continuous trend for miniaturization with concurrent functional integration. Processes in use today are typically efficient for mass production, but are not suitable for the pu

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f6e1fcb1889b7b593a3d712ae554bc3f

Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.

The SMARTLAM 3D-I Concept: Design of Microsystems from Functional Elements Fabricated by Generative Manufacturing Technologies.

Autor: Dickerhof, Markus, Kimmig, Daniel, Adamietz, Raphael, Iseringhausen, Tobias, Segal, Joel, Vladov, Nikola, Pfleging, Wilhelm, Torge, Maika

Publikováno v: Precision Assembly Technologies & Systems: 7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers; 2014, p147-160, 14p

Process Module Construction Kit for Modular Micro Assembly Systems.

Autor: Adamietz, Raphael, Iseringhausen, Tobias, Verl, Alexander

Publikováno v: Precision Assembly Technologies & Systems: 7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers; 2014, p126-132, 7p