Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Adam Skorek"'
Autor:
Joanicjusz Nazarko, Andrzej Magruk, Adam Skorek, Joanna Ejdys, Łukasz Nazarko, Katarzyna Halicka
Publikováno v:
Procedia Engineering. 182:482-490
The main purpose of the paper is to present the rationale, the methodological details and a practical example of the application of the enhanced SWOT analysis in the context of technological foresight. The authors take into account and propose an inn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::796b446c778155d74a5b38316f2be3a8
https://doi.org/10.1016/j.proeng.2017.03.140
https://doi.org/10.1016/j.proeng.2017.03.140
Publikováno v:
SAE International Journal of Aerospace. 6:441-446
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f61bc4ff91483afc2d0d92b71dbc514
https://doi.org/10.4271/2013-01-2157
https://doi.org/10.4271/2013-01-2157
Publikováno v:
IEEE Transactions on Industry Applications. 43:1164-1171
This paper presents a new rigorous approach to the calculation of current ratings in pipe-type cables with slow circulation of the fluid. Detailed mathematical analysis is presented for the calculation of the hot-spot fluid temperature as a function
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eac872172a6fc8984b829b0ab21c289f
https://doi.org/10.1109/tia.2007.904384
https://doi.org/10.1109/tia.2007.904384
Autor:
Adam Skorek, A. Lakhsasi
Publikováno v:
Solid-State Electronics. 46:925-932
Stress analysis is of crucial importance in the design of components and systems in the electronic industry. This paper presents a dynamic finite element approach dynamic finite element approach for following the evolution of residual thermal stress
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd7b3491115d43aab6b8585b4ae6cecf
https://doi.org/10.1016/s0038-1101(02)00008-4
https://doi.org/10.1016/s0038-1101(02)00008-4
Publikováno v:
Simulation Practice and Theory. 5:315-331
The transient thermal stability of x-ray mask SiC-W has been numerically studied with special reference to the effect of silicon carbide (SiC) thermal conductivity. This paper presents the transient modeling of an x-ray lithography mask undergoing sh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a43d82afc4bfcdd535c11b908c8da8ff
https://doi.org/10.1016/s0928-4869(96)00014-6
https://doi.org/10.1016/s0928-4869(96)00014-6
Autor:
Mohammed Laredj, Adam Skorek
Publikováno v:
CCECE
We present an overview of an approach to the thermal modeling of the grapheme-based nanostructures, and its implementation in high performance computing (HPC) system. As example of graphene-based nanosystem, a single electron transistor (SET) is disc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af4d9d3190268c283b547629ec908ad6
https://doi.org/10.1109/ccece.2012.6334951
https://doi.org/10.1109/ccece.2012.6334951
Publikováno v:
IAS
In this paper, we present the conjugate heat transfer analysis in a 167-kVA dry-type transformer using the parallel version of the computational fluid dynamics code Fluent 6.0. The renormalization group kappa-epsiv model is proposed to compute the tu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5943b32a9aab3a8a074153edaba57bf6
https://doi.org/10.1109/ias.2007.152
https://doi.org/10.1109/ias.2007.152
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
In this paper, we are presenting a genetic algorithm adopted for electro-thermal optimization in nanoelectronics devices and systems. The model of nanoelectronic system is simplified. Each heat source will be approximated by a specific function. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c06ac25b39c171fc4954f6a1f896cff9
https://doi.org/10.1115/ipack2007-33827
https://doi.org/10.1115/ipack2007-33827
Autor:
Mohamad Issa, Adam Skorek
Publikováno v:
CCECE
Heat transfer at nanoscale is of importance for many nanotechnology applications. There are typically two types of problems. One is the management of heat; the other is to manipulate the heat flow and energy conversion. In this paper we review the st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::196c1e7182badb95e978d9adcceaf6ba
https://doi.org/10.1109/ccece.2006.277281
https://doi.org/10.1109/ccece.2006.277281
Autor:
Adam Skorek, Stephane Ble
Publikováno v:
CCECE
These paper overviews a numerical parallel approach to the thermal phenomena analysis at the nanoscale level. We are assuming that the effect of a single electron can be important to the thermal phenomena linked to a nano-device. To illustrate this i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df80430cf46761900b6e6eaf3b449253
https://doi.org/10.1109/ccece.2006.277278
https://doi.org/10.1109/ccece.2006.277278