Zobrazeno 1 - 6
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pro vyhledávání: '"Adam R. Klempner"'
Publikováno v:
Strain. 45:295-300
Microelectromechanical systems (MEMS) are typically fabricated out of materials that are mechanically sound at the microscale, but can be relatively poor electrical conductors. For this reason, areas of MEMS can be coated with various thin metal film
Autor:
Adam R. Klempner, Donald R. Skelton, Ryan T. Marinis, Ryszard J. Pryputniewicz, Peter Hefti, James L. Zunino
Publikováno v:
SPIE Proceedings.
Development of MEMS constitutes one of the most challenging tasks in today's micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional characteri
Publikováno v:
Fracture of Nano and Engineering Materials and Structures ISBN: 9781402049712
Many classes of MEMS devices, such as those with resonant structures, capacitive readouts, and diaphragm elements, are sensitive to stresses that are exerted by their surrounding package structure. Such stresses can arise as a result of changes in te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49e6ac4eec68ca0912b7205d32381a55
https://doi.org/10.1007/1-4020-4972-2_32
https://doi.org/10.1007/1-4020-4972-2_32
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
Development of microelectromechanical systems (MEMS) constitutes one of the most challenging tasks in today’s micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for det
Publikováno v:
Microelectromechanical Systems.
Advances in MEMS, also called microsystems, require the use of computational modeling and simulation with physical measurements, i.e., measurements and modeling (M&M) approach is needed. We believe that successful combination of computer aided design
Autor:
Joseph W. Soucy, Peter Hefti, Thomas F. Marinis, Ryszard J. Pryputniewicz, Adam R. Klempner, Ryan T. Marinis
Publikováno v:
MRS Proceedings. 968
Gold-tin braze is the preferred material for attaching high-precision MEMS inertial sensors within hermetic ceramic packages. The bonds can be made at relatively low temperatures, are mechanically robust, and outgas at very low rates in vacuum sealed