Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Adam Pearl"'
Autor:
Hannan A Maqsood, Adam Pearl, Awni Shahait, Basmah Shahid, Santosh Parajuli, Harendra Kumar, Khaled J. Saleh
Publikováno v:
Surgeries, Vol 5, Iss 3, Pp 577-608 (2024)
Purpose: Proximal femur fractures (PFFs) in elderly patients lead to decreased productivity. Skilled nursing facilities (SNFs) and inpatient rehabilitation facilities (IRFs) are non-home destinations for post-discharge disposition. This study aims to
Externí odkaz:
https://doaj.org/article/8deeee61ba984ea28729654bdb0a808a
Publikováno v:
Surgeries, Vol 5, Iss 2, Pp 125-134 (2024)
Spine and hip abnormalities frequently occur together in most of the orthopedic population; therefore, both of these abnormalities impact the outcomes of the modalities that are being used. Few studies have reported reduced dislocation and revision r
Externí odkaz:
https://doaj.org/article/c3074097958e44549425aa914865c0b3
Autor:
Adam Pearl MD, Aya Ismail BS, Tariq Alsadi BS, Zachary Crespi MD, Mohammad Daher BS, Khaled Saleh MD
Publikováno v:
Geriatric Orthopaedic Surgery & Rehabilitation, Vol 14 (2023)
Background Total joint arthroplasties are among the most common surgical procedures performed in the United States. Although numerous safeguards are in place to optimize patient health and safety pre-, intra-, and postoperatively, patient frailty is
Externí odkaz:
https://doaj.org/article/b6f1f41f55394c2f87ed8c1eea3582af
Autor:
Adel Hijazi, Ahmad Hasan, Adam Pearl, Ramiz Memon, Michael Debeau, Mariana Roldan, Mohamed E. Awad, Ehsen Abdul-Kabir, Khaled J. Saleh
Publikováno v:
Antibiotics, Vol 11, Iss 9, p 1187 (2022)
The number of orthopedic procedures, especially prosthesis implantation, continues to increase annually, making it imperative to understand the risks of perioperative complications. These risks include a variety of patient-specific factors, including
Externí odkaz:
https://doaj.org/article/1b1067871e294cefbd4ae611745c119c
Publikováno v:
Journal of the American Academy of Orthopaedic Surgeons. 31:229-238
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c9aa9b778963bc1d02b487662d9472a
https://doi.org/10.5435/jaaos-d-22-00722
https://doi.org/10.5435/jaaos-d-22-00722
Publikováno v:
Hand Surgery and Rehabilitation.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f5361e91311ce03bbf8ae0649ba4c29
https://doi.org/10.1016/j.hansur.2023.05.002
https://doi.org/10.1016/j.hansur.2023.05.002
Publikováno v:
Journal of Electronic Materials. 45:391-402
The effect of printed circuit board surface finish on the drop loading reliability of ball grid array (BGA) solder interconnects has been examined. The finishes examined include electroless nickel/electroless palladium/immersion gold (ENEPIG) and imm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e01ccafed1f6bad7f9b48cf9100adb8
https://doi.org/10.1007/s11664-015-4104-y
https://doi.org/10.1007/s11664-015-4104-y
Publikováno v:
Journal of Electronic Materials. 43:3885-3897
Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fabd3be386b92755b1aef46a5441533
https://doi.org/10.1007/s11664-014-3322-z
https://doi.org/10.1007/s11664-014-3322-z
Publikováno v:
Scopus-Elsevier
Surface finishes are used to preserve and promote solderability of exposed copper metallization on printed wiring boards. While in the best of worlds, the solder used in assembly should dictate the solder interconnect reliability, surface finishes ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6470339bea6219b976fb1ca4a219460e
https://doi.org/10.4071/isom-2013-ta44
https://doi.org/10.4071/isom-2013-ta44
Autor:
Michael Osterman, Adam Pearl
Publikováno v:
Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes.
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG), which has been used in component packaging, has been gaining attention as a surface finish for printed wiring boards. The primary role of a printed wiring board surface finish is to pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::727735b9e883c1a4d63321cd2a2fbb45
https://doi.org/10.1115/ipack2013-73278
https://doi.org/10.1115/ipack2013-73278