Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Adam P. Hinckley"'
Autor:
Adam P. Hinckley, Anthony J. Muscat
Publikováno v:
Solid State Phenomena. 314:54-59
Thin organic self-assembled monolayer films are used to promote adhesion and seal the pores of metal oxides as well as direct the deposition of layers on patterned surfaces. Defects occur as the self-assembled monolayer forms, and the number and type
Publikováno v:
ACS Applied Nano Materials. 3:3185-3194
Organosilane monolayers are part of many process flows in nanoelectronics and biotechnology because of their versatility. Monolayers that inhibit reactions on silicon/silicon oxide surfaces are nee...
Autor:
Anthony J. Muscat, Adam P. Hinckley
Publikováno v:
Langmuir : the ACS journal of surfaces and colloids. 36(15)
Organosilane monolayers containing long carbon chains are susceptible to damage when exposed to X-rays and other radiation during characterization or processing. The origin of the damage has been attributed to both energetic photons and photoelectron
Autor:
Adam P. Hinckley, Anthony J. Muscat
Publikováno v:
Langmuir : the ACS journal of surfaces and colloids. 36(10)
Defects occur as self-assembled monolayers form, and the number and type of defects depend on the surface preparation and deposition solvent, among other parameters. Indirect measures to detect defects using a layer property, such as the thickness or
Autor:
Adam P. Hinckley, Anthony J. Muscat
Publikováno v:
Solid State Phenomena. 282:232-237
Atomic layer deposition (ALD) was used to grow titanium nitride (TiN) on SiO2with TiCl4and N2H4. X-ray photoelectron spectroscopy (XPS) and ellipsometry were used to characterize film growth. A hydrogen-terminated Si (Si-H) surface was used as a refe
Publikováno v:
ECS Transactions. 80:163-170
III-V materials could be a substitute for Si and Ge in semiconductor device development because they possess higher carrier mobilities. Wet chemical cleaning and patterning of III-Vs produces soluble species that can remain in the liquid phase, preci
Publikováno v:
ECS Meeting Abstracts. :1006-1006
Selective removal of native silicon dioxide (NOx) relative to the underlying Si substrate and to other films present in a device structure is important in forming low resistance electrical contacts. Xenon difluoride (XeF2) was chosen as the F-source