Effect of hydrolysis rates on the morphology of sol-gel derived SrFeCo0.5Ox powder.

Autor: Abothu, I.R.¹, Jin, W.¹ wanqin.jin@uni-koeIn.de, Wang, R.², Chung, T.-S.³ chencts@nus.edu.sg

Publikováno v: Journal of Materials Science. Jan2004, Vol. 39 Issue 2, p707-709. 3p.

Organic-Based RF Capacitors with Ceramic-Like Properties.

Autor: Jin-Hyun Hwang, Raj, P.M., Abothu, I.R., Chong Yoon, Iyer, M., Hyung-Mi Jung, Jong-Kuk Hong, Tummala, R.

Publikováno v: 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p1866-1869, 4p

Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates.

Autor: Lee, K.J., Bhattacharya, S., Varadarajan, M., Lixi Wan, Abothu, I.R., Sundaram, V., Muthana, P., Balaraman, D., Raj, P.M., Swaminathan, M., Sitaraman, S., Tummala, R., Viswanadham, P., Dunford, S., Lauffer, J.

Publikováno v: Proceedings International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces, 2005; 2005, p249-254, 6p

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects.

Autor: Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.

Publikováno v: 2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, p69-73, 5p

Multifunctional integrated substrate technology for high density SOP packaging.

Autor: Fuhan Liu, Tummala, R.R., Sundaram, V., Guidotti, D., Zhaoran Huang, Chang, Y.-J., Abothu, I.R., Raj, P.M., Bhattacharya, S., Balaraman, D., Chang, G.K.

Publikováno v: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design & Packaging & Component Failure Analysis (HDP '04); 2004, p83-90, 8p