Výsledky vyhledávání - "Abigail L. Dudek"

Utilizing an α,β-Unsaturated Dicarboxylic Acid for a Defect Initiated Residue Removal During Cu post-Chemical Mechanical Planarization Cleaning

Autor: Tatiana Cahue, Abigail L. Dudek, Jason Keleher, Adam Caridi, Kiana Cahue

Publikováno v: ECS Journal of Solid State Science and Technology. 11:123006

The development of post-Chemical Mechanical Planarization (p-CMP) cleaning processes is critical for the continued miniaturization of Integrated Circuit (IC) and logic device architecture. In order for further extension of Moore’s Law the minimizat

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4cadbbdc6c36da4fca5acc8569701b94
https://doi.org/10.1149/2162-8777/aca932

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Development of Slurry Formulations for Molybdenum-Chemical Mechanical Planarization (Mo-CMP)

Autor: Jason Keleher, Abigail L. Dudek

Publikováno v: ECS Meeting Abstracts. :2352-2352

As integrated circuit (IC) technology continues to advance, the challenge to extend Moore’s law without sacrificing power density and energy efficiency is critical. One method of achieving these goals is through the utilization of Chemical Mechanic

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b22588cdb6b615320dd1f325588eb97c
https://doi.org/10.1149/ma2022-02642352mtgabs

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Design of 'Low Stress' Post-CMP Cleaning Processes for Advanced Technology Nodes

Autor: Kiana A. Cahue, Abigail L. Dudek, Mantas M. Miliauskas, Tatiana R. Cahue, Amy Mlynarski, Jason J. Keleher

Publikováno v: ECS Meeting Abstracts. :1242-1242

As integrated circuit and logic device feature sizes approach the 3-nm node, limiting induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning) is of utmost importance. The CMP process can cause var

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e771d18b090388ba71a0e5111cd972fc
https://doi.org/10.1149/ma2022-01281242mtgabs

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(Invited) Synergistic Effect of Polyvinyl Alcohol (PVA) Brush Type and Cleaning Chemistry Formulation for Copper (Cu) Post-Chemical Mechanical Planarization (p-CMP) Cleaning

Autor: Jason J. Keleher, Kiana A. Cahue, Katherine M. Wortman-Otto, Abigail N. Linhart, Adam T Caridi, Abigail L. Dudek

Publikováno v: ECS Meeting Abstracts. :655-655

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ac0914d4c62b48e97823f653865f1856
https://doi.org/10.1149/ma2021-0214655mtgabs

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Role of Molecular Structure on Modulating the Interfacial Dynamics for Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Applications

Autor: Brian M. Sherry, Katherine M. Wortman-Otto, Abigail L. Dudek, Abigail N. Linhart, Jason J. Keleher

Publikováno v: ECS Journal of Solid State Science and Technology. 10:024009

As feature sizes continue to shrink well beyond the 7 nm node, understanding the delicate balance present in the chemical mechanical planarization (CMP) process is of utmost importance. In order to achieve high through-put and defect-free CMP process

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::89b808ffd1358cadf737e7105fa424fa
https://doi.org/10.1149/2162-8777/abe7aa

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