Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Abhishek Ramanujan"'
Publikováno v:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Autor:
Abhishek Ramanujan, Tamara Monti, Patrick DeRoy, Micajah Worden, Marina Y. Koledintseva, Waldemar Schulz, Cyrous Rostamzadeh
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 63:398-409
Integrated circuit (IC) and printed circuit board (PCB) electromagnetic (EM) modeling methods are becoming essential during the development of automotive electronic control units. Academic and industrial efforts focus on radiated and conducted emissi
Autor:
Cyrous Rostamzadeh, Abhishek Ramanujan, Patrick DeRoy, Tamara Monti, Micajah Worden, Waldemar Schulz
Publikováno v:
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
Integrated circuit (IC) and printed circuit board (PCB) electromagnetic (EM) modeling methods are becoming essential during the development of automotive electronic control units (ECUs). Academic and industry efforts focus on radiated and conducted e
Autor:
Franck Bayle, Dan Borza, Pierre Richard Dahoo, Philippe Descamps, Pascal Dherbecourt, Abdelkhalak El Hami, Philippe Eudeline, Maxime Fontaine, Christian Gautier, Eric Joubert, Moncef Kadi, Alain Kamdel, Samh Khemiri, Malika Khettab, Ludovic Lacheze, Olivier Latry, Jorge Linares, Hichame Maanane, Patrick Martin, Ioana Nistea, Hubert Polaert, Philippe Pougnet, Bouchaïb Radi, Abhishek Ramanujan, Zouheir Riah
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a2a79edfb444707fecdd52fa022dcd3a
https://doi.org/10.1016/b978-1-78548-260-1.50018-2
https://doi.org/10.1016/b978-1-78548-260-1.50018-2
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 54:254-261
This paper presents a simple and practical method to reproduce and predict the time-domain behavior of the radiated electromagnetic fields of microwave circuits. The previously developed frequency-domain model is extended toward predicting the large-
Publikováno v:
Progress In Electromagnetics Research B. 27:365-384
In this paper, a parametric electromagnetic radiated emis- sion model has been explored. Several mathematical improvements with respect to its extraction and computational performance have been deployed. The model, represented with an array of radiat
Autor:
Christian Marot, Jean-Luc Levant, Frederic Lafon, Etienne Sicard, Abhishek Ramanujan, Alexandre Boyer
Publikováno v:
Proceedings of EMC Compo 2015
EMC Compo
EMC Compo
International audience; A new international standard proposal (IEC 62433-2 Edition 2.0) is in progress. The main purpose of the standard is to provide an Integrated Circuit Emission Model – Conducted Emission (ICEM-CE) along with a data exchange fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a34290634ffc3d07b30fa64b905a858e
https://hal.archives-ouvertes.fr/hal-01225367/file/EMC_COMPO_2015_RAMANUJAN_SICARD_Final.pdf
https://hal.archives-ouvertes.fr/hal-01225367/file/EMC_COMPO_2015_RAMANUJAN_SICARD_Final.pdf
Publikováno v:
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).
In order to perform EMC design activities, engineers need to have some tools for preliminary risk analysis to determine filters needs and/or architecture orientation choices. Huge variations in term of requirements between different carmakers can be
Publikováno v:
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).
As electromagnetic compatibility (EMC) gains ground in today's world of electronics, integrated circuit (IC) and printed circuit board (PCB) modelling methods are of paramount importance during development of EMC compliant products. One such aspect f
Publikováno v:
Embedded Mechatronic Systems 1
Embedded Mechatronic Systems 1, Elsevier, pp.57-77, 2015, ⟨10.1016/B978-1-78548-013-3.50003-6⟩
Embedded Mechatronic Systems 1, Elsevier, pp.57-77, 2015, ⟨10.1016/B978-1-78548-013-3.50003-6⟩
The designers of hyperfrequency modules accord particular importance to electromagnetic compatibility. To protect hyperfrequency power modules from external electromagnetic disturbances, such modules are enclosed inside metallic cavities. This preven
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4dfb196e8571a4867d26a4e6f0fc34bc
https://hal-normandie-univ.archives-ouvertes.fr/hal-02306900
https://hal-normandie-univ.archives-ouvertes.fr/hal-02306900