Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Abhijit Kaisare"'
Autor:
Bhavani P. Dewan-Sandur, Terry Dishongh, S. Pekin, Yongje Lee, Dereje Agonafer, Abhijit Kaisare, M.M. Hossain
Publikováno v:
Heat Transfer Engineering. 29:134-148
The convergence of computing and communications dictates building up rather than out. As consumers demand more functionality in their hand-held devices, the need for more memory in a limited space is increasing, and integrating various functions into
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72443b9ed5f9c4eb41d0f17f71dad3ca
https://doi.org/10.1080/01457630701673170
https://doi.org/10.1080/01457630701673170
Publikováno v:
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Through silicon via (TSV) technology is one of the most rapidly developing technologies in the semiconductor industries and assures the development for the continued role of Moore's law and multichip integration as well as packaging approaches. Wire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8873500766b8177fa993d3755591114
https://doi.org/10.1109/itherm.2012.6231423
https://doi.org/10.1109/itherm.2012.6231423
Autor:
Abhijit Kaisare, Anand Takawale, Aditya Vipradas, Vinay Swakul, Sandeep Tripathi, Sandeep Tonapi
Publikováno v:
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
LED is the revolution in the illumination industry due to its great performance of solid state lighting, environment friendly working, power saving and long lasting life. But dissipation of heat generated and subsequently the thermal management in th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05bf56a837f78cef18116c708865c898
https://doi.org/10.1109/itherm.2012.6231445
https://doi.org/10.1109/itherm.2012.6231445
Publikováno v:
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Photovoltaic power is emerging as a major power resource, steadily becoming more affordable and proving to be more reliable than utilities. The photovoltaic effect is the basic principal process by which a photovoltaic (PV) cell converts sunlight int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::368269faef27fea395e98a58962053ec
https://doi.org/10.1109/itherm.2012.6231566
https://doi.org/10.1109/itherm.2012.6231566
Publikováno v:
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Currently just a thousandth of a part of the total solar flux reaching our planet is being used as an effective energy source. In the foreseeable future this use is expected to rise where reliability will be a major factor worth consideration during
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f40526c9b6024d428125bb0dc74f202
https://doi.org/10.1109/itherm.2012.6231551
https://doi.org/10.1109/itherm.2012.6231551
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
A thermo-mechanical analysis is carried out on a stacked die package having through silicon via technology to study the overall reliability of the package due to varying aspect ratio (size and shape) of through silicon vias, silicon die thickness, un
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8833743288fc48bb80232041808f929e
https://doi.org/10.1115/ipack2011-52264
https://doi.org/10.1115/ipack2011-52264
Publikováno v:
Journal of Electronic Packaging. 131
Microprocessors continue to grow in capabilities, complexity, and performance. Microprocessors typically integrate functional components such as logic and level two cache memory in their architecture. This functional integration of logic and memory r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc90d52c39c7c70ed73d832bc1f0e1fe
https://doi.org/10.1115/1.3068303
https://doi.org/10.1115/1.3068303
Autor:
Dereje Agonafer, Gregory M. Chrysler, Ravi Mahajan, Abhijit Kaisare, A. Haji-Sheikh, Uthaman Raju
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28a0b50d747f6782050203586572c295
https://doi.org/10.1109/itherm.2008.4544302
https://doi.org/10.1109/itherm.2008.4544302
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
Since the advent of the transistor and integrated circuit, the performance of electronic equipment has increased significantly while footprint of systems at all levels continues to decrease. Recently, the number of transistors on a high end microproc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52ff435fe8967f20f94c489a3081ca52
https://doi.org/10.1115/ipack2007-33687
https://doi.org/10.1115/ipack2007-33687
Publikováno v:
Volume 5: Electronics and Photonics.
Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67c228dd9ed1b321ebc79bd2b9c77589
https://doi.org/10.1115/imece2007-43736
https://doi.org/10.1115/imece2007-43736