Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Abhay A. Watwe"'
Autor:
J. Torresola, Abhay A. Watwe, Ravi Prasher, Gregory M. Chrysler, D. Grannes, Chia-Pin Chiu, Ravindranath V. Mahajan
Publikováno v:
IEEE Transactions on Advanced Packaging. 28:659-664
In the microelectronics industry, power has traditionally been the key driver for thermal management. Cooling solutions are typically rated in terms of their power dissipation capacity and efficiency. However, overall power is not the only parameter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9821337e0007f5970594f6f1709b78a7
https://doi.org/10.1109/tadvp.2005.858439
https://doi.org/10.1109/tadvp.2005.858439
Autor:
Ravi Prasher, Abhay A. Watwe
Publikováno v:
Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques.
Traditional methods of estimating package thermal performance employ numerical modeling using commercially available finite-volume or finite-element tools. Use of these tools requires training and experience in thermal modeling. This methodology rest
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::791b1abcd868474e4e0bec8e39013c20
https://doi.org/10.1115/imece2001/htd-24385
https://doi.org/10.1115/imece2001/htd-24385
Autor:
Kourtidou, Dimitra1 (AUTHOR) dikourti@physics.auth.gr, Symeou, Elli2 (AUTHOR), Terzopoulou, Zoi3 (AUTHOR), Vasileiadis, Isaak1 (AUTHOR), Kehagias, Thomas1 (AUTHOR), Pavlidou, Eleni1 (AUTHOR), Kyratsi, Theodora2 (AUTHOR), Bikiaris, Dimitrios N.3 (AUTHOR), Chrissafis, Konstantinos1 (AUTHOR)
Publikováno v:
Polymer Composites. Mar2021, Vol. 42 Issue 3, p1181-1197. 17p.