Výsledky vyhledávání - "Abdur Rahman Aad"

Akademický článek

Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study

Autor: Md. Maruf Billah, Abdur Rahman Aad, Shimanta Das, Mohammad Motalab, Ratul Paul

Publikováno v: Alexandria Engineering Journal, Vol 66, Iss , Pp 79-96 (2023)

The implementation of environment friendly technologies in microelectronic packaging industry has widened the essentialities of lead-free solder alloys. The Cu3Sn intermetallic compound is blameworthy for the adverse influences of the mechanical and

Externí odkaz: https://doaj.org/article/ae422c0521bd4af3a1ef2f90624433bf

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Akademický článek

Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study

Autor: Md. Maruf Billah, Shimanta Das, Abdur Rahman Aad, Ratul Paul

Publikováno v: Journal of Materials Research and Technology, Vol 20, Iss , Pp 2094-2108 (2022)

The necessities of lead-free solder alloys have been expanded by the advent of eco-friendly technologies of microelectronic packaging industry. Mostly lead-free solder alloys are SAC, which is the alloy of tin, silver and copper metal. Ag3Sn, Cu3Sn a

Externí odkaz: https://doaj.org/article/d778acf49fb34938a2f97b529771c5b5

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Dependence of Mechanical and Thermal Deformation Behaviors on Crystal Size and Direction of Cu3sn Intermetallic: A Molecular Dynamics Study

Autor: Md. Maruf Billah, Abdur Rahman Aad, Shimanta Das, Ratul Paul

Publikováno v: SSRN Electronic Journal.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::30b5d84fb75c930ee95770d4557bfed8
https://doi.org/10.2139/ssrn.4193387

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