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pro vyhledávání: '"Abdellah Salahoueldhadj"'
Autor:
Erik Sleeckx, Andy Miller, Pieter Bex, Arnita Podpod, Alain Phommahaxay, Alice Guerrero, John Slabbekoorn, Kim Yess, Abdellah Salahoueldhadj, Kim Arnold, Eric Beyne, G. Beyer, Julien Bertheau
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
As the need for higher degrees of function integration on chips continues to rise, chip-to-chip connection density exponentially increases. The continuous push for denser interconnects has brought conventional FO-WLP to its limit. A novel FO-WLP conc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6c787fc0dbf692ab0910773a997edda
https://doi.org/10.1109/ectc.2019.00059
https://doi.org/10.1109/ectc.2019.00059
