Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Aaron Voon Yew Thean"'
Autor:
Hari Krishna Salila Vijayalal Mohan, Wai Kit Chee, Yida Li, Suryakanta Nayak, Chueh Loo Poh, Aaron Voon Yew Thean
Publikováno v:
Materials & Design, Vol 186, Iss , Pp - (2020)
Biosynthetic production of vanillin via microbial biotransformation offers a low-cost alternative for manufacturers to meet the consumer demands for natural vanillin. However, identifying the high vanillin-producing microbial strains among multitudin
Externí odkaz:
https://doaj.org/article/462bfbf31ad947fab066428380a813b2
Autor:
Zefeng Xu, Baoshan Tang, Xiangyu Zhang, Jin Feng Leong, Jieming Pan, Sonu Hooda, Evgeny Zamburg, Aaron Voon-Yew Thean
Publikováno v:
Light: Science & Applications, Vol 11, Iss 1, Pp 1-11 (2022)
A novel nonlinear accelerator based on non-volatile opto-resistive RAM switch was proposed and demonstrated to enable fully in-situ photonic neural network.
Externí odkaz:
https://doaj.org/article/8c1f68b8449f49ac97dfc94498523ab9
Autor:
Yan Liu, Lu Ding, Yu Cao, Dongyang Wan, Guanghui Yuan, Baohu Huang, Aaron Voon-Yew Thean, Ting Mei, Thirumalai Venkatesan, Christian A. Nijhuis, Soojin Chua
Publikováno v:
IEEE Photonics Journal, Vol 12, Iss 5, Pp 1-10 (2020)
A CMOS-compatible plasmonic waveguide with a metal or metal-like strip sandwiched in-between dielectrics has been proposed for intra-chip communication in the more-than-Moore era. A sequence of numerical models has been presented to evaluate the plas
Externí odkaz:
https://doaj.org/article/bcd193d7adf242b39d002f3b5e1c5af8
Autor:
Maheswari Sivan, Yida Li, Hasita Veluri, Yunshan Zhao, Baoshan Tang, Xinghua Wang, Evgeny Zamburg, Jin Feng Leong, Jessie Xuhua Niu, Umesh Chand, Aaron Voon-Yew Thean
Publikováno v:
Nature Communications, Vol 10, Iss 1, Pp 1-12 (2019)
Designing efficient, scalable and low-thermal-budget 2D Materials for 3D integration remains a challenge. Here, the authors report the development of a hybrid-(solution-processed-exfoliated) integration of 2D Material based 1T1R which uses a multilay
Externí odkaz:
https://doaj.org/article/c8ee57ce86a64b64b1bf3b959c522e6c
Autor:
Chun-Kuei Chen, Sonu Hooda, Zihang Fang, Manohar Lal, Zefeng Xu, Jieming Pan, Shih-Hao Tsai, Evgeny Zamburg, Aaron Voon-Yew Thean
Publikováno v:
IEEE Transactions on Electron Devices. 70:2098-2105
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::232af7ccd8ba1f767351ee4c6c254c41
https://doi.org/10.1109/ted.2023.3242633
https://doi.org/10.1109/ted.2023.3242633
Autor:
Shih-Hao Tsai, Zihang Fang, Xinghua Wang, Umesh Chand, Chun-Kuei Chen, Sonu Hooda, Maheswari Sivan, Jieming Pan, Evgeny Zamburg, Aaron Voon-Yew Thean
Publikováno v:
ACS Applied Electronic Materials. 4:1642-1650
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4124935e6810ce8f739084021af8efd2
https://doi.org/10.1021/acsaelm.1c01321
https://doi.org/10.1021/acsaelm.1c01321
With high device integration density and evolving sophisticated device structures in semiconductor chips, detecting defects becomes elusive and complex. Conventionally, machine learning (ML)-guided failure analysis is performed with offline batch mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e58e37a429b9c33bd8be02ff56fab591
http://arxiv.org/abs/2303.07062
http://arxiv.org/abs/2303.07062
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64f9c1b807041dfb13e5b838c0dcb9cf
https://doi.org/10.1109/edtm55494.2023.10103073
https://doi.org/10.1109/edtm55494.2023.10103073
Autor:
Shih-Hao Tsai, Zhonghua Li, Ma Mo Mo Ei Phyu, Zihang Fang, Sonu Hooda, Chun-Kuei Chen, Evgeny Zamburg, Aaron Voon-Yew Thean
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::242ce0331bbcbf3c358fa64c65e81353
https://doi.org/10.1109/edtm55494.2023.10103049
https://doi.org/10.1109/edtm55494.2023.10103049
Autor:
Yifei Luo, Mohammad Reza Abidian, Jong-Hyun Ahn, Deji Akinwande, Anne M. Andrews, Markus Antonietti, Zhenan Bao, Magnus Berggren, Christopher A. Berkey, Christopher John Bettinger, Jun Chen, Peng Chen, Wenlong Cheng, Xu Cheng, Seon-Jin Choi, Alex Chortos, Canan Dagdeviren, Reinhold H. Dauskardt, Chong-an Di, Michael D. Dickey, Xiangfeng Duan, Antonio Facchetti, Zhiyong Fan, Yin Fang, Jianyou Feng, Xue Feng, Huajian Gao, Wei Gao, Xiwen Gong, Chuan Fei Guo, Xiaojun Guo, Martin C. Hartel, Zihan He, John S. Ho, Youfan Hu, Qiyao Huang, Yu Huang, Fengwei Huo, Muhammad M. Hussain, Ali Javey, Unyong Jeong, Chen Jiang, Xingyu Jiang, Jiheong Kang, Daniil Karnaushenko, Ali Khademhosseini, Dae-Hyeong Kim, Il-Doo Kim, Dmitry Kireev, Lingxuan Kong, Chengkuo Lee, Nae-Eung Lee, Pooi See Lee, Tae-Woo Lee, Fengyu Li, Jinxing Li, Cuiyuan Liang, Chwee Teck Lim, Yuanjing Lin, Darren J. Lipomi, Jia Liu, Kai Liu, Nan Liu, Ren Liu, Yuxin Liu, Yuxuan Liu, Zhiyuan Liu, Zhuangjian Liu, Xian Jun Loh, Nanshu Lu, Zhisheng Lv, Shlomo Magdassi, George G. Malliaras, Naoji Matsuhisa, Arokia Nathan, Simiao Niu, Jieming Pan, Changhyun Pang, Qibing Pei, Huisheng Peng, Dianpeng Qi, Huaying Ren, John A. Rogers, Aaron Rowe, Oliver G. Schmidt, Tsuyoshi Sekitani, Dae-Gyo Seo, Guozhen Shen, Xing Sheng, Qiongfeng Shi, Takao Someya, Yanlin Song, Eleni Stavrinidou, Meng Su, Xuemei Sun, Kuniharu Takei, Xiao-Ming Tao, Benjamin C. K. Tee, Aaron Voon-Yew Thean, Tran Quang Trung, Changjin Wan, Huiliang Wang, Joseph Wang, Ming Wang, Sihong Wang, Ting Wang, Zhong Lin Wang, Paul S. Weiss, Hanqi Wen, Sheng Xu, Tailin Xu, Hongping Yan, Xuzhou Yan, Hui Yang, Le Yang, Shuaijian Yang, Lan Yin, Cunjiang Yu, Guihua Yu, Jing Yu, Shu-Hong Yu, Xinge Yu, Evgeny Zamburg, Haixia Zhang, Xiangyu Zhang, Xiaosheng Zhang, Xueji Zhang, Yihui Zhang, Yu Zhang, Siyuan Zhao, Xuanhe Zhao, Yuanjin Zheng, Yu-Qing Zheng, Zijian Zheng, Tao Zhou, Bowen Zhu, Ming Zhu, Rong Zhu, Yangzhi Zhu, Yong Zhu, Guijin Zou, Xiaodong Chen
Publikováno v:
ACS Nano
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::19a2b347594f135ac8ff92e7d1e59618
https://hdl.handle.net/10356/166467
https://hdl.handle.net/10356/166467