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pro vyhledávání: '"Aaron J. Stewart"'
Publikováno v:
Soldering & Surface Mount Technology. 31:77-84
Purpose This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder alloys, in vibration loading conditions. Design/methodology/approach
Publikováno v:
Journal of Electronic Packaging. 140
In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board and adjusts the excitation