Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Aaron D. Brovont"'
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 5, Pp 1182-1196 (2024)
Current conducted emissions standards provide considerable flexibility in the handling of interface converters, which are of increasing importance for the design and implementation of microgrids. Of particular interest herein is the approach selected
Externí odkaz:
https://doaj.org/article/f646afa465db41f6a7308f67469935c2
Autor:
Jin Zhao, Aaron D. Brovont
Publikováno v:
Complex System Modeling and Simulation, Vol 3, Iss 2, Pp 118-128 (2023)
Machine stator winding insulation degradation is one of the main results of machine aging. It is non-negligible once this degradation process becomes asymmetric between phases. The traditional way to determine the insulation state of health is a part
Externí odkaz:
https://doaj.org/article/5e0e51ad51fb442a83f5da5c9b920923
Publikováno v:
IEEE Transactions on Energy Conversion. 38:1481-1484
Publikováno v:
IEEE Transactions on Power Electronics. 38:4647-4657
Autor:
Aaron D. Brovont, Steven D. Pekarek
Publikováno v:
Engineering Analysis with Boundary Elements. 132:77-93
Closed-form solutions are derived for the regular and adjacent-singular integrals involving the two-dimensional Laplacian’s Green’s function and its normal derivative that arise in the Galerkin BEM. Motivation for their use is provided by compari
Publikováno v:
2022 Wireless Power Week (WPW).
Publikováno v:
IEEE Transactions on Power Electronics. 35:8034-8049
Modern power converters designed with wide band-gap (WBG) semiconductors are known to generate substantial conducted electromagnetic interference (EMI) as a side effect of high-edge-rate and high-frequency switching. This article provides a consolida
Publikováno v:
IEEE Transactions on Power Electronics. 35:4678-4688
The fast edge rates achievable by wide-bandgap semiconductors can produce significant common-mode (CM) leakage currents through the baseplates of encompassing power modules, which are known to produce elevated electromagnetic signatures for power ele
Autor:
Andrew N. Lemmon, Aaron D. Brovont
Publikováno v:
2021 IEEE Electric Ship Technologies Symposium (ESTS).
This paper provides an analysis of the factors influencing the conducted emissions of interface converters, which are of increasing importance for the design and implementation of microgrids. Of particular interest herein is the approach selected for
Publikováno v:
2021 IEEE Applied Power Electronics Conference and Exposition (APEC).
This work evaluates the electromagnetic interference (EMI) of a silicon carbide (SiC) MOSFET multi-chip power module (MCPM) with emerging organic direct bonded copper (ODBC) substrates. The thin, ductile organic insulator in ODBC substrates allows fo