Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Aalok Trivedi"'
Publikováno v:
Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C.
Computational Fluid Dynamics (CFD) is widely used in the telecommunication industry to validate experimental data and obtain both qualitative and quantitative results during product development. A typical outdoor telecommunications cabinet requires t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d22ed83f1f18b29e3d9b21f23d54436
https://doi.org/10.1115/imece2008-68134
https://doi.org/10.1115/imece2008-68134
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
Since the advent of the transistor and integrated circuit, the performance of electronic equipment has increased significantly while footprint of systems at all levels continues to decrease. Recently, the number of transistors on a high end microproc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52ff435fe8967f20f94c489a3081ca52
https://doi.org/10.1115/ipack2007-33687
https://doi.org/10.1115/ipack2007-33687
Autor:
Roger R. Schmidt, Aalok Trivedi, Michael J. Ellsworth, Dereje Agonafer, Nikhil Lakhkar, Madhusudhan Iyengar
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
With the continuing industry trends towards smaller, faster and higher power devices, thermal management continues to be extremely important in the development of electronics. In this era of high heat fluxes, air cooling still remains the primary coo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f523ad5f9431b2d4ea24e77f9a34a23
https://doi.org/10.1115/ipack2007-33975
https://doi.org/10.1115/ipack2007-33975