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Autor:
A.T. Murphy, F.J. Young
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:228-237
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d2f6676e6a253c697e741ddae4ee218
https://doi.org/10.1109/33.219409
https://doi.org/10.1109/33.219409
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 40:1857-1869
A moment-method technique based on using a combined quasi-dynamic, dynamic, and asymptotic approach is presented for the analysis of nonuniform microstrip transmission lines and discontinuities. It uses the grounded dielectric slab Green's functions.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54a634ce07ec61f39370051243f7e0f8
https://doi.org/10.1109/22.159622
https://doi.org/10.1109/22.159622
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 39:75-82
A quasi-dynamic approach is presented for the analysis of arbitrarily oriented printed microstrip circuits. The metallic structures are assumed to be planar metals of zero thickness. The quasi-dynamic approach differs from the quasi-static solution i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::210382df2d56464628fd2cd8ab9f4f08
https://doi.org/10.1109/22.64608
https://doi.org/10.1109/22.64608
Publikováno v:
Proceedings of Japan International Electronic Manufacturing Technology Symposium.
A 181 pin Pin Grid Array (PGA) was characterized using time and frequency domain techniques to identify major sources of signal degradation. The pins, as well as a layer of plating lines that was included for electroplating the exterior metal surface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e374980267cbbd1edef6b83fe1907c0
https://doi.org/10.1109/iemt.1993.639776
https://doi.org/10.1109/iemt.1993.639776
Autor:
A.T. Murphy, F.J. Young
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
The electrical design, analysis and performance of tabular capacitors are presented. Simple formulas for capacitances are derived for spiral and concentric type tabular capacitors. By numerical methods the regions of greatest electric stress in the d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbef18387de97caede55f9b7fc0b0b8c
https://doi.org/10.1109/ectc.1992.204263
https://doi.org/10.1109/ectc.1992.204263
Publikováno v:
1992 IEEE Microwave Symposium Digest MTT-S.
The authors present a numerical technique based on a combined approach that uses a quasi-dynamic, a dynamic and an asymptotic method for the analysis of non-uniform microstrip transmission lines and discontinuities with grounded dielectric slab Green
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c2a1aae322e658bb356c02718d2b84b
https://doi.org/10.1109/mwsym.1992.188188
https://doi.org/10.1109/mwsym.1992.188188
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
A Land Grid Array (LGA) package was designed and fabricated to utilize specific materials and design concepts for high speed operation. The performance of this LGA was compared with that of a functionally and dimensionally equivalent Pin Grid Array (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::35f290c1ff977f22e3e1f0f0db635c60
https://doi.org/10.1109/ectc.1993.346812
https://doi.org/10.1109/ectc.1993.346812
Autor:
A.T. Murphy, F.J. Young
Publikováno v:
1991 Proceedings 41st Electronic Components & Technology Conference.
The high-frequency performance of capacitors is related to their geometry and material properties. By considering multilayer capacitors as distributed electrical systems, the tools of ICONSIM are applied to study resonant frequencies, equivalent circ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a626e3653d73a5f0877c11df6ff5e361
https://doi.org/10.1109/ectc.1991.163898
https://doi.org/10.1109/ectc.1991.163898
Publikováno v:
40th Conference Proceedings on Electronic Components and Technology.
The inductance of the power and ground planes and associated vias is investigated for a high-performance single-chip package. The current distribution in the planes is determined using a novel vector potential. The magnetic intensity in all spatial c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6f94e0af9b710508e8f11eb044ef1ec
https://doi.org/10.1109/ectc.1990.122181
https://doi.org/10.1109/ectc.1990.122181