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pro vyhledávání: '"A.R. Tilgner"'
Correction to 'A Simple Test Chip to Assess Chip and Package Design in the Case of Plastic Assemblin
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 18:862
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5eb95198605369d9dd440ef37ec0f988
https://doi.org/10.1109/tcpma.1995.477474
https://doi.org/10.1109/tcpma.1995.477474
