Zobrazeno 1 - 10
of 21
pro vyhledávání: '"A.N.R. Wagiman"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1999-2003
Silicon dies were thinned down and bump pitch became smaller to have a lot of input/output in electronic device packages especially in package on package configuration. This presents challenges on underfill (UF) dispense processing. UF voids occurred
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be05537bc723b9ba20b9a02a741b197b
https://doi.org/10.1109/tcpmt.2014.2363014
https://doi.org/10.1109/tcpmt.2014.2363014
Publikováno v:
Polymers for Advanced Technologies. 19:308-315
Epoxy composites containing particulate fillers-fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a03445aad88c91b1b2757eddb4166a84
https://doi.org/10.1002/pat.1014
https://doi.org/10.1002/pat.1014
Publikováno v:
Journal of Composite Materials. 42:129-142
Epoxy composites with mineral silica containing 0—60 vol% were prepared using a mechanical stirrer. Ethanol at 10wt% was used as the diluent in the epoxy system. The mechanical properties of epoxy composites were studied through flexural and single
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::022fbe1362e5fabb61447d03a6a54bfc
https://doi.org/10.1177/0021998307078721
https://doi.org/10.1177/0021998307078721
Publikováno v:
Polymer Composites. 29:27-36
Polymer materials have been used extensively as the organic substrate materials in electronic packaging industry. The mechanical, thermal, and morphology properties of the alternative low cost composites have been investigated in this article. One of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::227e1d4717817e3465a236e6dddb2422
https://doi.org/10.1002/pc.20345
https://doi.org/10.1002/pc.20345
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:824-829
A mechanical approach employing cyclic twisting deformation to a surface mount assembly is examined as an alternative to temperature cycling for evaluating solder joints fatigue performance. This highly accelerated test is aimed at reducing solder jo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c839d611177b660be3927f6f8a43daf7
https://doi.org/10.1109/tcapt.2007.906297
https://doi.org/10.1109/tcapt.2007.906297
Autor:
A.N.R. Wagiman, K.S. Beh, Hazizan Md Akil, K.N. Seetharamu, Pei Leng Teh, M. Mariatti, C.K. Yeoh
Publikováno v:
Materials Letters. 61:2156-2158
Epoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials are noted from the thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a31a8723063e7a744a04a0ecfb5616b2
https://doi.org/10.1016/j.matlet.2006.08.036
https://doi.org/10.1016/j.matlet.2006.08.036
Publikováno v:
AIP Conference Proceedings.
This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dime
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0d78b183bf62330ac316a69bac3e4cf
https://doi.org/10.1063/1.4704209
https://doi.org/10.1063/1.4704209
Autor:
A.N.R. Wagiman
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
Intel's Moore's Law focuses on shrinking the transistors in the silicon to be able to pack more and more transistors for a given area. In general, Intel has been able to double the transistor count every 18–24 months and has been doing so while kee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66347c22852c0e14a7757eaeb3375c9a
https://doi.org/10.1109/iemt.2010.5746753
https://doi.org/10.1109/iemt.2010.5746753
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
The mechanics of solder joints in a surface mount assembly subjected to cyclic flexural load is examined using finite element method. A test assembly with peripheral-array solder joints is supported by eight pins and arranged in a circle on the compo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93af6c53d68f67630f17b67d239cf44a
https://doi.org/10.1109/iemt.2006.4456440
https://doi.org/10.1109/iemt.2006.4456440
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Increasing demands in the electronic packaging industries have led to the need for high-performance organic substrate material like epoxy composites. High . This paper investigates the effect of ethanol as diluent in epoxy composites containing 0 to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac040da975d9495092e6642e87e2e2f2
https://doi.org/10.1109/iemt.2006.4456466
https://doi.org/10.1109/iemt.2006.4456466