Zobrazeno 1 - 10
of 63
pro vyhledávání: '"A.B. Lostetter"'
Autor:
Marcelo Schupbach, Caleb Paul Gutshall, A.B. Lostetter, Homer Alan Mantooth, I. Escorcia-Carranza, Khoa Minh Phan, Bradley A. Reese, Javier Valle-Mayorga
Publikováno v:
IEEE Transactions on Power Electronics. 27:4417-4424
Silicon Carbide (SiC) power semiconductors have shown the capability of greatly outperforming Si-based power devices. Faster switching and smaller on-state losses coupled with higher voltage blocking and temperature capabilities make SiC an attractiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54b02f7b75b4915f1caa688aa01416e0
https://doi.org/10.1109/tpel.2011.2182213
https://doi.org/10.1109/tpel.2011.2182213
Autor:
W. Cilio, B. Passmore, Ty McNutt, Edgar Cilio, Jack Bourne, A.B. Lostetter, J. Hornberger, B. Reese, B. McPherson, M. Schupbach, Robert Shaw
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000402-000406
A high temperature, high performance power module was developed for extreme environment systems and applications to exploit the advantages of wide bandgap semiconductors. These power modules are rated > 1200V, > 100A, > 250 °C, and are designed to h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f36146c913d706abc02b3354b6837c63
https://doi.org/10.4071/hitec-thp22
https://doi.org/10.4071/hitec-thp22
Autor:
P. Doyle, Jared Hornberger, H. Procell, R. Shaw, Roberto Schupbach, B. McPherson, A.B. Lostetter
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000345-000353
The goal of this study is to investigate packaging techniques for extreme environment (i.e., −50 °C to 250 °C) power electronics. Areas of interest include substrate materials and baseplate/heat spreader materials. Multiple substrate technologies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe2a46943446612415d1ba96881bfe39
https://doi.org/10.4071/hitec-2012-tha23
https://doi.org/10.4071/hitec-2012-tha23
Publikováno v:
International Symposium on Microelectronics. 2012:001105-001115
The packaging design and development of an on-board bi-directional charger for the battery system of the next generation Toyota Prius plug-in hybrid electric vehicle (PHEV) will be presented in this paper. The charger implements a multichip power mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0453e305164336823443e386ceeeb785
https://doi.org/10.4071/isom-2012-thp33
https://doi.org/10.4071/isom-2012-thp33
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:000283-000288
This paper discusses the development of a high temperature (i.e., 230 °C ambient) 100V–300V/15V 20W isolated power supply. The power supply is implemented using Silicon-Carbide (SiC) power switches, high-temperature silicon on insulator (HTSOI) co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b039206fae9d2db534402d9390db50de
https://doi.org/10.4071/hitec-rschupbach-wp21
https://doi.org/10.4071/hitec-rschupbach-wp21
Publikováno v:
Extended Abstracts of the 2010 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bf1f0b08e74134f2dd21efc159c8d4b
https://doi.org/10.7567/ssdm.2010.k-2-1
https://doi.org/10.7567/ssdm.2010.k-2-1
Autor:
Jared Hornberger, B. McPherson, K. Okumura, R. Shaw, Juan Carlos Balda, Marcelo Schupbach, Takukazu Otsuka, Brian Rowden, M. Miura, Bradley A. Reese, Alan Mantooth, A.B. Lostetter
Publikováno v:
2009 IEEE Vehicle Power and Propulsion Conference.
This paper presents the challenges and results of fabricating a high temperature silicon carbide based integrated power module. The gate driver for the module was integrated into the power package and is rated for an ambient temperature of 250 °C. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::042116a173a48b738c3adcb1c5c0814f
https://doi.org/10.1109/vppc.2009.5289735
https://doi.org/10.1109/vppc.2009.5289735
Publikováno v:
2008 34th Annual Conference of IEEE Industrial Electronics.
High reliability power electronic systems intended for space applications present unique design challenges. Size, cost, and fault tolerance are key forces driving space based designs. A power system architecture capable of addressing these factors is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a000ff63669222cee93281a7624842c
https://doi.org/10.1109/iecon.2008.4758412
https://doi.org/10.1109/iecon.2008.4758412
Autor:
A.B. Lostetter, Roberto Schupbach, Homer Alan Mantooth, E. Johnson, Simon S. Ang, Osama Saadeh, Juan Carlos Balda
Publikováno v:
2008 IEEE Power and Energy Society General Meeting - Conversion and Delivery of Electrical Energy in the 21st Century.
As utilities face increasing fault currents in their systems as a result of increasing demand and/or deployment of new technologies, fault current limiters promise a solution that will mitigate the need for replacing existing breakers as well as bein
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4696dc31c6daff9252273993f8f418d9
https://doi.org/10.1109/pes.2008.4596612
https://doi.org/10.1109/pes.2008.4596612
Publikováno v:
2008 IEEE Aerospace Conference.
Spacecraft routinely experience extreme environmental conditions, including cryogenic (as low as -230degC) and elevated temperatures (as high as +130degC). Presently, the temperature of the spacecraft electronics is regulated to its safe operating te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f35bdf05c580b5c030ed7765c7dc8c15
https://doi.org/10.1109/aero.2008.4526490
https://doi.org/10.1109/aero.2008.4526490