Zobrazeno 1 - 10
of 51
pro vyhledávání: '"A.A. Yasseen"'
Akademický článek
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Publikováno v:
Scopus-Elsevier
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::656219cee712434cf0053a290471401e
https://doi.org/10.4028/www.scientific.net/msf.338-342.1141
https://doi.org/10.4028/www.scientific.net/msf.338-342.1141
Publikováno v:
Journal of Microelectromechanical Systems. 8:172-179
This paper explores the use of thick glass films as suitable alternatives to CVD oxide films for use as sacrificial, planarization, and passivation layers in polysilicon surface micro-machining processes. Such glasses can be spin-coated to produce fi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb6f631d47cdd2ddd920ff5c90e408a0
https://doi.org/10.1109/84.767113
https://doi.org/10.1109/84.767113
Publikováno v:
Journal of Microelectromechanical Systems. 8:237-242
As an alternative to conventional SiC reactive ion etching (RIE), polycrystalline (poly-SiC) films were patterned into micron-sized structures using sacrificial SiO/sub 2/ and polycrystalline silicon (polysilicon) molds in conjunction with mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59c221fb08a8a0ae5a8dca4ae7d2bdc6
https://doi.org/10.1109/84.788626
https://doi.org/10.1109/84.788626
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 5:26-32
This paper describes a 1/spl times/8 rotary electrostatic micromotor optical switch fabricated using high-aspect-ratio micromachining technology to produce silicon or nickel components which are subsequently assembled to form a switch. The switch con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::23b48795c46df0e645389a9100bf6b6c
https://doi.org/10.1109/2944.748101
https://doi.org/10.1109/2944.748101
Publikováno v:
Journal of The Electrochemical Society. 146:327-330
In order to develop a low-cost alternative to diamond-based polishing slurries for SiC, mechanical polishing of 3C-SiC films using SiC-based slurries was studied, and an optimized polishing recipe was developed. The relationship among applied force,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61a744e440df97852172c1a9ad100a96
https://doi.org/10.1149/1.1391608
https://doi.org/10.1149/1.1391608
Akademický článek
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Publikováno v:
Journal of Electronic Materials. 27:L17-L20
This paper reports on a process to fabricate single-crystal 3C-SiC on SiO2 structures using a wafer bonding technique. The process uses the bonding of two polished polysilicon surfaces as a means to transfer a heteroepitaxial 3C-SiC film grown on a S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39219feb526a1bc7d0b350f3e6410622
https://doi.org/10.1007/s11664-998-0207-z
https://doi.org/10.1007/s11664-998-0207-z
Publikováno v:
Materials Science Forum. :223-226
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b50bb53244f2546276a386dd043b770
https://doi.org/10.4028/www.scientific.net/msf.264-268.223
https://doi.org/10.4028/www.scientific.net/msf.264-268.223
Publikováno v:
Journal of The Electrochemical Society. 144:237-242
This paper explores the use of chemical-mechanical polishing (CMP) in polysilicon surface micromachining for removing the inherent surface roughness of polysilicon to create a mirror surface finish and for globally planarizing the wafer surface to ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50a2ca29cfde44b72fd7501a78f603c2
https://doi.org/10.1149/1.1837391
https://doi.org/10.1149/1.1837391