Zobrazeno 1 - 10
of 79
pro vyhledávání: '"A.A. Gavrikov"'
Comparative Analysis of Methods for Measuring Thermal Resistance of Gallium Nitride HEMT-Transistors
Publikováno v:
Proceedings of Universities. ELECTRONICS. 25:219-233
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b83b666150630201d3cb427bc6fe094e
https://doi.org/10.24151/1561-5405-2020-25-3-219-233
https://doi.org/10.24151/1561-5405-2020-25-3-219-233
Publikováno v:
IEEE Journal of Photovoltaics. 9:775-779
This paper describes a modulation method of measuring the thermal impedance of solar modules. The measurements are taken by varying heating power harmonically and measuring a variable component of the junction temperature, which changes in response t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c153b231eacd40d317c166db1c4abad
https://doi.org/10.1109/jphotov.2019.2897349
https://doi.org/10.1109/jphotov.2019.2897349
Publikováno v:
Journal of Radio Electronics.
The results of power solar batteries' thermal resistance measurements are described. A distinctive feature of such batteries is the high heat capacity of the semiconductor material, as well as the high total electrical capacity of p-n-junctions. This
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c4052e9e050b3c9fd96e5ba47816a13
https://doi.org/10.30898/1684-1719.2021.4.15
https://doi.org/10.30898/1684-1719.2021.4.15
Publikováno v:
Journal of Radio Electronics. 2020
The paper describes the results of investigation of thermophysical processes in power modules. Measuring the thermal field caused by dies heating due to flow of heating current shows uniform temperature distribution in the area of dies mount. This in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64519a57e8cbd2fa2c0313ccb698d99c
https://doi.org/10.30898/1684-1719.2020.12.12
https://doi.org/10.30898/1684-1719.2020.12.12
Publikováno v:
Journal of Radio Electronics. 2020
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1580eb9a1bda561fa8cf7e7905a3991b
https://doi.org/10.30898/1684-1719.2020.5.11
https://doi.org/10.30898/1684-1719.2020.5.11
Autor:
Vitaliy Ivanovich Smirnov, Alexandr Alexandrovich Kulikov, A.A. Gavrikov, Viacheslav Andreevich Sergeev
Publikováno v:
2020 Moscow Workshop on Electronic and Networking Technologies (MWENT).
The paper describes the studies of current localization processes while measuring the thermal resistance of a solar cells. The study object was the monocrystalline silicon solar element, 52 × 52 mm2 size, placed on the heat sink using thermal grease
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a6300666ea1c421bd4b59c5dd370e02
https://doi.org/10.1109/mwent47943.2020.9067386
https://doi.org/10.1109/mwent47943.2020.9067386
Publikováno v:
IEEE Transactions on Power Electronics. 33:6211-6216
Modulation method and the device for thermal impedance measuring of power mosfet s and IGBT transistors, and measurement results are described. The measurements were performed by generic modulation method that implies heating a device under test by p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e789f56747b199d97730ad26bf16ba1
https://doi.org/10.1109/tpel.2017.2740961
https://doi.org/10.1109/tpel.2017.2740961
Publikováno v:
Microelectronics Reliability. 80:205-212
The paper describes the modulation method of measuring the thermal impedance of semiconductor devices as well as its implementation. In contrast to the standard method (JESD51-1 standard) which requires heating the device under test by the stepped po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba6b3858d2ca795e8cdead902e4b5bf0
https://doi.org/10.1016/j.microrel.2017.11.024
https://doi.org/10.1016/j.microrel.2017.11.024
Akademický článek
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Akademický článek
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