Zobrazeno 1 - 10
of 122
pro vyhledávání: '"A. Peizerat"'
Publikováno v:
Technologies, Vol 10, Iss 2, p 38 (2022)
In this paper, we present a thorough analysis of parasitic coupling effects between different electrodes for a 3D Sequential Integration circuit example comprising stacked devices. More specifically, this study is performed for a Back-Side Illuminate
Externí odkaz:
https://doaj.org/article/41ebbdc9c9b745698489d7fe1b25f5c1
Publikováno v:
Technologies
Technologies, 2022, 10 (2), pp.38. ⟨10.3390/technologies10020038⟩
Technologies; Volume 10; Issue 2; Pages: 38
Technologies, 2022, 10 (2), pp.38. ⟨10.3390/technologies10020038⟩
Technologies; Volume 10; Issue 2; Pages: 38
This article belongs to the Special Issue MOCAST 2021; International audience; In this paper, we present a thorough analysis of parasitic coupling effects between different electrodes for a 3D Sequential Integration circuit example comprising stacked
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::615b807878d05c12091490d767beb87f
https://hal.science/hal-03876789/file/Parasitic_Coupling_in_3D_Sequential_Integration_Th.pdf
https://hal.science/hal-03876789/file/Parasitic_Coupling_in_3D_Sequential_Integration_Th.pdf
Autor:
P. Batude, O. Billoint, S. Thuries, P. Malinge, C. Fenouillet-Beranger, A. Peizerat, G. Sicard, P. Vivet, S. Reboh, C. Cavalcante, L. Brunet, M. Ribotta, L. Brevard, X. Garros, T. Mota Frutuoso, B. Sklenard, J. Lacord, J. Kanyandekwe, S. Kerdiles, P. Sideris, C. Theodorou, V. Lapras, M. Mouhdach, G. Gaudin, G. Besnard, I. Radu, F. Ponthenier, A. Farcy, E. Jesse, F. Guyader, T. Matheret, P. Brunet, F. Milesi, L. Le Van-Jodin, A. Sarrazin, B. Perrin, C. Moulin, S. Maitrejean, M. Alepidis, I. Ionica, S. Cristoloveanu, F. Gaillard, M. Vinet, F. Andrieu, J. Arcamone, E. Ollier
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a954addef7e27e3dfae349b36fd38937
https://doi.org/10.1109/iedm19574.2021.9720671
https://doi.org/10.1109/iedm19574.2021.9720671
Publikováno v:
MOCAST
2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST)
2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST), Jul 2021, Thessaloniki, Greece. ⟨10.1109/MOCAST52088.2021.9493347⟩
2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST)
2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST), Jul 2021, Thessaloniki, Greece. ⟨10.1109/MOCAST52088.2021.9493347⟩
This study investigates the inter-tier coupling, for a Back-Side Illuminated (BSI) 4-Transistor (4T) pixel with its diode and Transfer Gate on the bottom tier and the rest of its circuitry on the top tier of a 3D Sequential Integration (3DSI) process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a1711090bfe8e6b968fbb8bd6e972c74
https://doi.org/10.1109/mocast52088.2021.9493347
https://doi.org/10.1109/mocast52088.2021.9493347
Publikováno v:
Sensors, Vol 16, Iss 4, p 514 (2016)
This paper presents an overview of the read noise in CMOS image sensors (CISs) based on four-transistors (4T) pixels, column-level amplification and correlated multiple sampling. Starting from the input-referred noise analytical formula, process leve
Externí odkaz:
https://doaj.org/article/8726688c8d904b36b84ae0dfdc975b22
Publikováno v:
Technologies (2227-7080); Apr2022, Vol. 10 Issue 2, pN.PAG-N.PAG, 12p
Publikováno v:
PRIME
This work presents a framework for behavioral simulations of smart imagers with hardware and power constraints. The objective is to compare innovative imaging systems that would be composed of a specific image sensor and a dedicated image processing.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a4c8f65c2127afc530eb4907e403293
https://doi.org/10.1109/prime.2019.8787750
https://doi.org/10.1109/prime.2019.8787750
Publikováno v:
IEEE Journal of Solid-State Circuits. 51:2180-2191
A sub- $0.5\,\text {e}^{-}_{\text {rms}}$ temporal read noise VGA (640H ${\times }480\text {V}$ ) CMOS image sensor has been integrated in a standard $0.18\,\mu \text {m}~4$ PM CMOS process. The low noise performance is achieved exclusively through c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1ddc6b2ca25acf191e25f7b6d505855b
https://doi.org/10.1109/jssc.2016.2579643
https://doi.org/10.1109/jssc.2016.2579643
Publikováno v:
Electronic Imaging. 32:145-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0cb8d2d4aca1b686fcce5858dfc35f69
https://doi.org/10.2352/issn.2470-1173.2020.7.iss-145
https://doi.org/10.2352/issn.2470-1173.2020.7.iss-145
Publikováno v:
NEWCAS
In this paper, a new architecture of a photovoltaic mode pixel is presented. This pixel array embeds the capability to continuously harvest solar energy thanks to its photovoltaic mode of operation while one pixel row is in an imaging configuration.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::faeff5739807cbd26299daea8a7b42ed
https://doi.org/10.1109/newcas.2018.8585561
https://doi.org/10.1109/newcas.2018.8585561