Capacitive micromachined ultrasonic transducers leak detection by dye penetrant test

Autor: Nowodzinski, A., Ndjoye-Kogou, O., Mourier, V., Nonglaton, G., Bouchu, D., Fain, B., Giroud, S.

Publikováno v: In Microelectronics Reliability November 2020 114

Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.

Capacitive micromachined ultrasonic transducers leak detection by dye penetrant test

Autor: G. Nonglaton, A. Nowodzinski, David Bouchu, B. Fain, S. Giroud, V. Mourier, O. Ndjoye-Kogou

Publikováno v: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 114, pp.113908-. ⟨10.1016/j.microrel.2020.113908⟩
Microelectronics Reliability, 2020, 114, pp.113908-. ⟨10.1016/j.microrel.2020.113908⟩

International audience; Dye penetrant test has been used to detect non hermetic capacitive micromachined ultrasonic transducers (CMUTs). The method has proven its ability to highlight faulty CMUTs membranes among more than hundreds of CMUTs membranes

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::93e6baea92345564d9802cb82bf7aa81
https://hal.archives-ouvertes.fr/hal-03493284

1/f Noise Characterization of Piezoresistive Nano-Gauges for MEMS Sensors

Autor: Helene Lhermer, Dihia Sidi Ahmed, Audrey Berthelot, Antoine Nowodzinski, Alexandra Kournela, Christoforos G. Theodorou, Helene Duchemin, Cyril Dressler

Publikováno v: 2018 IEEE SENSORS
2018 IEEE SENSORS, Oct 2018, New Delhi, India. pp.1382, ⟨10.1109/ICSENS.2018.8589872⟩

session C1L-A: gas sensors & stochastic effects; International audience; This paper describes the study carried out in order to characterize the influence of the main fabrication steps of the silicon nano-gauge on their l/f noise. Geometry of the nan

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::11e3c3e02d9f29233da1bbbce89aaf80
https://hal.science/hal-02002311

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding

Autor: L. Di Cioccio, F. Aussenac, A. Nowodzinski, Emmanuel Rolland, Pierre-Henri Jouneau, Thomas Signamarcheix, G. Romano, Perceval Coudrain, Stephane Moreau, Y. Beilliard

Publikováno v: 3DIC

Cu-SiO2 direct hybrid bonding is considered as one of the most promising approaches for matching the needs of three dimensional integrated circuits (3D-IC). In this paper we present the results of a complete morphological, electrical and reliability

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4b98f446192efc82524b56aee1869c2a
https://doi.org/10.1109/3dic.2014.7274306