Zobrazeno 1 - 2
of 2
pro vyhledávání: '"A. Kornlit"'
Autor:
G. Timp, K.K. Bourdelle, J.E. Bower, F.H. Baumann, T. Boone, R. Cirelli, K. Evans-Lutterodt, J. Garno, A. Ghetti, H. Gossmann, M. Green, D. Jacobson, Y. Kim, R. Kleiman, F. Klemens, A. Kornlit, C. Lochstampfor, W. Mansfield, S. Moccio, D.A. Muller, I.E. Ocola, M.I. O'Malley, J. Rosamilia, J. Sapjeta, P. Silverman, T. Sorsch, D.M. Tennant, W. Timp, B.E. Weir
Publikováno v:
International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).
One of the primary means for improving performance and increasing the scale of integration on a chip is the miniaturization of the electronic devices that comprise it. The SIA roadmap projects that future gains in performance will continue to accrue
Autor:
Timp, G., Bourdelle, K.K., Bower, J.E., Baumann, F.H., Boone, T., Cirelli, R., Evans-Lutterodt, K., Garno, J., Ghetti, A., Gossmann, H., Green, M., Jacobson, D., Kim, Y., Kleiman, R., Klemens, F., Kornlit, A., Lochstampfor, C., Mansfield, W., Moccio, S., Muller, D.A.
Publikováno v:
International Electron Devices Meeting 1998 Technical Digest (Cat No98CH36217); 1998, p615-618, 4p