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Autor:
Akihiko Happoya
Publikováno v:
Journal of The Surface Finishing Society of Japan. 71:771-774
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5b050f58c153a6d728c9d306da6934b
https://doi.org/10.4139/sfj.71.771
https://doi.org/10.4139/sfj.71.771
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 821, Pp 14-00382-14-00382 (2014)
In this study, the thermal fatigue life of substrate with Cu through-hole is evaluated by considering the mechanical properties of Cu thin film and glass fiber cloths structure. We first conducted tensile tests of Cu thin film and found that the rate
Externí odkaz:
https://doaj.org/article/0785babc552848e4b50397f9565d67a4
Autor:
Kunio Mori, Akihiko Happoya
Publikováno v:
Journal of the Japan Society of Powder and Powder Metallurgy. 63:323-327
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87259eb7586083e15405f1acfbf3b9ef
https://doi.org/10.2497/jjspm.63.323
https://doi.org/10.2497/jjspm.63.323
Publikováno v:
2018 IEEE CPMT Symposium Japan (ICSJ).
In this paper, a small shielded Bluetooth Low Energy module equipped with a slot antenna is presented. The slot antenna is formed on both a module substrate and a shield layer. The slot on the module substrate is short compared with the slot on the s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9bd39ae5d88c4e6ed67881f325e3ea91
https://doi.org/10.1109/icsj.2018.8602918
https://doi.org/10.1109/icsj.2018.8602918
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this paper, a land grid array-type ultra-small shielded module that has a 2.4 GHz slot antenna is presented. Slots are patterned on both an interposer and a shield layer. The slots are connected at the side of the interposer and compose the slot a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0384d3f63cadb6ff1bc910c0e69119e9
https://doi.org/10.1109/ectc.2018.00036
https://doi.org/10.1109/ectc.2018.00036
Publikováno v:
Transactions of the JSME (in Japanese). 81:14-00382
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d83e751180bea149b51af9a452517cb
https://doi.org/10.1299/transjsme.14-00382
https://doi.org/10.1299/transjsme.14-00382
Autor:
Akihiko Happoya
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:348-352
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::853566d1a827e0e0c74f7c9f4002b889
https://doi.org/10.5104/jiep.17.348
https://doi.org/10.5104/jiep.17.348
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:117-122
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26c6231907428f9e651eaf6516f6f6c2
https://doi.org/10.5104/jiep.17.117
https://doi.org/10.5104/jiep.17.117
Autor:
Akihiko Happoya
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:183-183
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8d21fa91b89209b351d7c39ef93de0a6
https://doi.org/10.5104/jiep.22.183
https://doi.org/10.5104/jiep.22.183