Zobrazeno 1 - 10
of 21
pro vyhledávání: '"A. C. M. Ahamed"'
Autor:
W. M. S. C. Samarasinghe, Manjula Fernando, J.R.S.S. Kumara, A. U. A. W. Gunawardena, A. C. M. Ahamed
Publikováno v:
IEEE Transactions on Dielectrics and Electrical Insulation. 23:1409-1417
Increased moisture content (MC) is considered as one of the main factors for the failure of transformer insulation. This paper presents a method of estimating the MC of a transformer pressboard insulation based on the relative permittivity and loss t
Publikováno v:
2015 IEEE 10th International Conference on Industrial and Information Systems (ICIIS).
Measurement of dielectric properties of copper clad printed circuit boards using microstrip ring resonators is a well-studied problem widely in use. The problem addressed here is different from this as the sample under test is difficult to copper cla
Autor:
Wustoni, Shofarul1,2 (AUTHOR) s.wustoni@itb.ac.id, Ohayon, David3 (AUTHOR), Hermawan, Angga4 (AUTHOR), Nuruddin, Ahmad5 (AUTHOR), Inal, Sahika3 (AUTHOR), Indartono, Yuli Setyo1 (AUTHOR), Yuliarto, Brian1,5 (AUTHOR) brian@itb.ac.id
Publikováno v:
Polymer Reviews. 2024, Vol. 64 Issue 1, p192-250. 59p.
Publikováno v:
Chemical Science; 10/7/2024, Vol. 15 Issue 37, p15023-15086, 64p
Autor:
Faniband, Basheerabegum, Sarvesha chandra, S, Sreekanth, R, Aravinda, T, Pattar, Jayadev, Kotrappanavar Nataraj, Sanna, Nagaraja, M
Publikováno v:
IOP Conference Series: Materials Science & Engineering; 2024, Vol. 1300 Issue 1, p1-6, 6p
Autor:
Liu, Cong1 (AUTHOR) greencong2000@sina.com
Publikováno v:
Journal of Physical Organic Chemistry. Feb2021, Vol. 34 Issue 2, p1-8. 8p.
Autor:
Zhang, Daning, Xu, Lulin, Wu, Ming, Jiang, Jiongting, Shao, Xianjun, Mu, Haibao, Zhang, Guanjun
Publikováno v:
Review of Scientific Instruments; Oct2023, Vol. 94 Issue 10, p1-14, 14p
Autor:
Messire, Gatien1, Massicot, Fabien1, Vallée, Alexis1, Vasse, Jean‐Luc1, Behr, Jean‐Bernard1 jb.behr@univ‐reims.fr
Publikováno v:
European Journal of Organic Chemistry. 2/21/2019, Vol. 2019 Issue 7, p1659-1668. 10p.
Publikováno v:
Chemical Communications; 2/21/2023, Vol. 59 Issue 15, p2118-2121, 4p
Publikováno v:
IEEE Transactions on Dielectrics & Electrical Insulation; Apr2022, Vol. 29 Issue 2, p693-700, 8p