Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications

Autor: O. Dezellus, Laurent Gremillard, A. Ben Kabaar, Cyril Buttay, Anthony Gravouil, Rafael Estevez

Publikováno v: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.06.001⟩

International audience; Direct Bonded Copper (DBC) are produced by high temperature (>1000 °C) bonding between copper and a ceramic (usually alumina). They are commonly used in power electronics. However, their reliability when exposed to thermal cy

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::17133219f94fd23ebc407985167631f2
https://hal.archives-ouvertes.fr/hal-01541230

Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications

Autor: Aymen Ben Kabaar, Cyril Buttay, Olivier Dezellus, Rafael Estevez, Anthony Gravouil, Laurent Gremillard

Publikováno v: HAL
ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management"
ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany

International audience

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::8f9015c959dd3aa1afc36caeed006f85
https://hal.archives-ouvertes.fr/hal-01935060