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Autor:
G. R. Hayes, H. J. van de Wiel, Adriana Lapadatu, Maaike M. Visser Taklo, A-S. B. Vardoy, H. R. Fischer
Publikováno v:
2012 4th Electronic System-Integration Technology Conference, ESTC 2012, 17 September 2012 through 20 September 2012, Amsterdam
A flux-less copper-tin (Cu-Sn) solid-liquid inter-diffusion (SLID) bonding process, providing a cost-effective hermetic vacuum sealing at wafer-level, has been investigated. Observations have been made indicating that the storage time of Cu-Sn plated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5d4d43f97f52822f62724fc082863c57
http://resolver.tudelft.nl/uuid:c39489b4-b95a-4445-8ad4-6f54e89b6976
http://resolver.tudelft.nl/uuid:c39489b4-b95a-4445-8ad4-6f54e89b6976
