Zobrazeno 1 - 8
of 8
pro vyhledávání: '"A-S. B. Vardoy"'
Autor:
G. R. Hayes, H. J. van de Wiel, Adriana Lapadatu, Maaike M. Visser Taklo, A-S. B. Vardoy, H. R. Fischer
Publikováno v:
2012 4th Electronic System-Integration Technology Conference, ESTC 2012, 17 September 2012 through 20 September 2012, Amsterdam
A flux-less copper-tin (Cu-Sn) solid-liquid inter-diffusion (SLID) bonding process, providing a cost-effective hermetic vacuum sealing at wafer-level, has been investigated. Observations have been made indicating that the storage time of Cu-Sn plated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5d4d43f97f52822f62724fc082863c57
http://resolver.tudelft.nl/uuid:c39489b4-b95a-4445-8ad4-6f54e89b6976
http://resolver.tudelft.nl/uuid:c39489b4-b95a-4445-8ad4-6f54e89b6976
Autor:
Zhou, Yuanzhi, Xu, Weiliang, Ji, Yongsheng, Zhou, Guoyuan, Wu, Wenfeng, Chen, Zibin, Wang, Beibei, Gui, Xuchun, Li, Xinming
Publikováno v:
Applied Physics Reviews; Jun2023, Vol. 10 Issue 2, p1-11, 11p
Publikováno v:
Journal of Microelectromechanical Systems; Feb2021, Vol. 30 Issue 1, p64-71, 8p
Publikováno v:
2015 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP); 2015, p1-4, 4p
Publikováno v:
2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-6, 6p
Autor:
Aasmundtveit, Knut E., Luu, Thi-Thuy, Vardoy, Astrid-Sofie B., Tollefsen, Torleif A., Wang, Kaiying, Hoivik, Nils
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-6, 6p
Publikováno v:
Metallurgical & Materials Transactions. Part A; Nov2015, Vol. 46 Issue 11, p5266-5274, 9p, 1 Color Photograph, 6 Diagrams, 2 Charts, 3 Graphs
Wearable devices have the potential to transform multiple facets of human life, including healthcare, activity monitoring, and interaction with computers. At the same time, a number of technical and adaption challenges hinder widespread and daily usa