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pro vyhledávání: '"A L S Loke"'
Autor:
Alvin L. S. Loke, S. Simon Wong, Niranjan A. Talwalkar, Jeffrey T. Wetzel, Paul H. Townsend, Tsuneaki Tanabe, Raymond N. Vrtis, Melvin P. Zussman, Devendra Kumar
Publikováno v:
MRS Proceedings. 564
The industry is strongly interested in integrating low–κ dielectrics with Damascene copper. Otherwise, with conventional materials, interconnects cannot continue to scale without limiting circuit performance. Integration of copper wiring with sili
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f82dfcd33623da25e87506d0797fcd10
https://doi.org/10.1557/proc-564-535
https://doi.org/10.1557/proc-564-535
