Zobrazeno 1 - 10
of 15
pro vyhledávání: '"A E-J Lin"'
Autor:
Y. X. Lin, J. Y. Wang, E. J. Lin, Ching Yu Yeh, Pai Jung Chang, Chung Yu Chiu, C. Y. Wu, Cheng Yi Liu, Chia Hung Lee
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:567-576
The effect of Ag solutes on the solid-state Cu dissolution in the Sn3.5Ag solder was studied. The solid-state Cu dissolution depends on the dissolution of the interfacial Cu6Sn5 compound layer, which is constant with time. In a low annealing temperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da5cacd0ed1c1b62aca15008551f6801
https://doi.org/10.1007/s10854-020-04839-w
https://doi.org/10.1007/s10854-020-04839-w
Autor:
M. L. Cheng, Cheng Yi Liu, J. Y. Wang, C. Y. Hsiao, W. X. Zhuang, A. L. Liu, Ching Yu Yeh, Y. K. Tang, Y. H. Chen, C. Y. Wu, E. J. Lin, Chia Hung Lee, Chung Yu Chiu, Y. X. Lin
Publikováno v:
Journal of Electronic Materials. 49:26-33
In this work, the effect of the chemical additives (surfactant, stabilizer) on the corrosion resistance of the Ni(P) layer was investigated. The average O content at the depth of 1 nm of the tested Ni(P) specimens was used as the indication of the co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7accd7a09f77b2907d3217a3897a29b
https://doi.org/10.1007/s11664-019-07626-4
https://doi.org/10.1007/s11664-019-07626-4
Autor:
Y. X. Lin, Pai Jung Chang, Y. K. Tang, Ching Yu Yeh, E. J. Lin, C. Y. Wu, Cheng Yi Liu, J. Y. Wang, W. X. Zhuang
Publikováno v:
Journal of Alloys and Compounds. 797:684-691
This study investigates the kinetics of solid-state dissolution of Ni into Sn and Sn3.5Ag solders. At annealing temperatures of 150, 180, and 200 °C for 100–400 h, more amount of Ni was dissolved in Sn3.5Ag solder than in pure solder. The activati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a33badfa864e56f38c4e6017050ef30f
https://doi.org/10.1016/j.jallcom.2019.05.146
https://doi.org/10.1016/j.jallcom.2019.05.146
Autor:
Chia Hung Lee, Ching Yu Yeh, Chung Yu Chiu, C. Y. Wu, J. Y. Wang, Y. X. Lin, Cheng Yi Liu, Bo Rong Huang, Kuan Lin Fu, E. J. Lin
Publikováno v:
Nanomaterials
Volume 11
Issue 7
Nanomaterials, Vol 11, Iss 1630, p 1630 (2021)
Volume 11
Issue 7
Nanomaterials, Vol 11, Iss 1630, p 1630 (2021)
Tensile tests were carried on the electroplated Cu films with various densities of twin grain boundary. With TEM images and a selected area diffraction pattern, nano-twinned structure can be observed and defined in the electroplated Cu films. The den
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f0f7f95e3cb7ead31016a7f95081612f
Publikováno v:
Materials Chemistry and Physics. 271:124882
This work investigates the effect of the external compressive pressure on the interdiffsuion between Pd and Cu. By analyzing ESCA atomic depth profiling without/with the external compressive pressure, two important findings were observed: (1) Pd/Cu(2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96e8757574d69e3e994c704b52cfe4f4
https://doi.org/10.1016/j.matchemphys.2021.124882
https://doi.org/10.1016/j.matchemphys.2021.124882
Publikováno v:
Journal of Electronic Materials. 47:77-83
Two multilayer bonding structures have been designed to die-bond light-emitting diode (LED) chips on Ag/Cu thermal substrate, viz. Sn/ZnBi/Sn bilayer solder structure and Sn/BiZnBi/Sn sandwich solder structure. Both multilayer bonding structures succ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2794bbf2b97adfd82720ab70eb70caa0
https://doi.org/10.1007/s11664-017-5754-8
https://doi.org/10.1007/s11664-017-5754-8
Publikováno v:
Journal of Materials Science: Materials in Electronics. 28:15149-15153
This work investigated the effect of interfacial dissolution on electromigration failures at metal micro-joint Interface. A theoretical model is first developed to define the critical temperature, which determines the EM-induced failure (either voidi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07e0c9bb51b8ff70f99f0b88bb73bc81
https://doi.org/10.1007/s10854-017-7391-7
https://doi.org/10.1007/s10854-017-7391-7
Publikováno v:
Journal of Electronic Materials. 45:6079-6085
Wetting reactions of pure Sn and Sn-Ag-Cu solder balls on Au(100 A and 1000 A)/Pd(500 A)/Ni substrates were investigated. The (Au, Pd)Sn4 phase formed in the initial interfacial reaction between pure Sn and Au(100 A and 1000 A)/Pd(500 A)/Ni substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a24f702bde832feab9517b4dc4e4e37f
https://doi.org/10.1007/s11664-016-4941-3
https://doi.org/10.1007/s11664-016-4941-3
Publikováno v:
Journal of Electronic Materials. 45:6171-6176
In this study, light emitting diode (LED) chips were die-bonded on a Ag/Cu substrate by a Sn-BixZn-Sn bonding system. A high die-bonding strength is successfully achieved by using a Sn-BixZn-Sn ternary system. At the bonding interface, there is obser
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9ea45cb3b4597db8e53d84a9f983983
https://doi.org/10.1007/s11664-016-4885-7
https://doi.org/10.1007/s11664-016-4885-7
Autor:
Cheng Yi Liu, E. J. Lin, J. Y. Wang, Y. X. Lin, Chia Hung Lee, Chung Yu Chiu, Y. K. Tang, C. Y. Wu, C.P. Wang
Publikováno v:
Materials Chemistry and Physics. 250:122960
In this work, we studied the effect of the reaction between the depositing atoms and the substrate element on the morphological evolution of the each deposition of the Sn–Bi–Sn multilayer structure on the Cu substrate. For the deposition of the s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bde4cce4bf306de5121c89c38b8d53bc
https://doi.org/10.1016/j.matchemphys.2020.122960
https://doi.org/10.1016/j.matchemphys.2020.122960