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Thermal and Power-Aware Run-time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

Autor: Halima Najibi, Alexandre Levisse, Giovanni Ansaloni, Marina Zapater, David Atienza

Publikováno v: Great Lakes Symposium on VLSI
Proceedings of the Great Lakes Symposium on VLSI 2022

Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1af86afbdb6798c0ce5f72bdd7601bd

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Enabling Optimal Power Generation of Flow Cell Arrays in 3D MPSoCs with On-Chip Switched Capacitor Converters

Autor: David Atienza, Miroslav Vasic, Jorge Hunter, Alexandre Levisse, Halima Najibi, Marina Zapater

Publikováno v: ISVLSI
2020 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)

Flow cell arrays (FCAs) provide efficient on-chip liquid cooling and electrochemical power generation capabilities in three-dimensional multi-processor systems-on-chip (3D MPSoCs). When connected to power delivery networks (PDNs) of chips, the curren

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e31c4803eb6d7c598a81bc198435b2a6
https://doi.org/10.1109/isvlsi49217.2020.00014

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PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

Autor: Arvind Sridhar, Bruno Michel, Artem Aleksandrovich Andreev, Mohamed M. Sabry, Marina Zapater, David Atienza, Patrick Ruch

Publikováno v: IEEE Transactions on Computers

Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48fc3baa785050cfc4170dfa2b06ee84
https://doi.org/10.1109/tc.2017.2695179

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Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint

Autor: Ying-Lin Zhao, Weisheng Zhao, Yuanqing Cheng, Aida Todri-Sanial, Jianlei Yang

Publikováno v: Journal of Computer Science and Technology
Journal of Computer Science and Technology, Springer Verlag, 2018, 33 (5), pp.966-983. ⟨10.1007/s11390-018-1868-6⟩

International audience; Thanks to the emerging 3D integration technology, The multiprocessor system on chips (MPSoCs) can now integrate more IP cores on chip with improved energy efficiency. However, several severe challenges also rise up for 3D ICs

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9e0814ca70b8166fd27f6ec52e02070c
https://hal-lirmm.ccsd.cnrs.fr/lirmm-01879928/file/manuscript_new.pdf

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Akademický článek

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Akademický článek

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Towards thermally-aware design of 3D MPSoCs with inter-tier cooling

Autor: Navid Borhani, Thomas Brunschwiler, John R. Thome, Yuksel Temiz, David Atienza, Sylwia Szczukiewicz, Bruno Michel, Yusuf Leblebici, Arvind Sridhar, Mohamed M. Sabry

Publikováno v: DATE
Scopus-Elsevier

New tendencies envisage 3D Multi-Processor System-On-Chip (MPSoC) design as a promising solution to keep increasing the performance of the next-generation high-performance computing (HPC) systems. However, as the power density of HPC systems increase

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7811c68d7ca060b8d538d883a10676cf
https://doi.org/10.1109/date.2011.5763237

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Conference

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Design and management of three-dimensional multi-processor systems-on-chip with integrated flow cell arrays

Autor: Najibi, Halima

Three-Dimensional Multi-Processor Systems-on-Chip (3D MPSoCs) are promising solutions for highly intensive Artificial Intelligence (AI) and Big Data applications. They combine remarkably dense computation capabilities and massive communication bandwi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::edd407fcecd6d963572cf2647a5f9a23
https://infoscience.epfl.ch/record/298437

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