Zobrazeno 1 - 10
of 10
pro vyhledávání: '"黄建盛"'
Publikováno v:
Biotechnology Bulletin; 12/26/2022, Vol. 38 Issue 12, p312-323, 12p
Autor:
Huang, Chien-Sheng, 黃建盛
102
Climate change due to global warming causes extreme weather phenomena worldwide. This not only causes a lot of losses, but also threatens the natural environment and human beings. The worldwide governments pay great attention to the greenhou
Climate change due to global warming causes extreme weather phenomena worldwide. This not only causes a lot of losses, but also threatens the natural environment and human beings. The worldwide governments pay great attention to the greenhou
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/67005681060946151603
Autor:
Huang, Chien -Sheng, 黃建盛
100
In this study, a novel bio-mimetic structure with cam producing variant rotation motion of foil is designed and assembled. Visualization and measurement of averaged velocity of air flow in duct driven by oscillating foil have been made. Most
In this study, a novel bio-mimetic structure with cam producing variant rotation motion of foil is designed and assembled. Visualization and measurement of averaged velocity of air flow in duct driven by oscillating foil have been made. Most
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/30363440255217977467
Autor:
Jian-Cheng Huang, 黃建盛
92
Roof’s anatomy method is a lot of materials technology to reorganize and consolidate, and it’s also traditional to compose technology with a part of various and complex closely linked. Besides, to make use of diversification mortar, a roo
Roof’s anatomy method is a lot of materials technology to reorganize and consolidate, and it’s also traditional to compose technology with a part of various and complex closely linked. Besides, to make use of diversification mortar, a roo
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/69128838104901151473
Autor:
Chien-Sheng Huang, 黃建盛
91
Flip chip technology with BGA interconnection has attracted a great deal of attention in today’s electronics packaging. One of the challenging issues is the material selection for under bump metallization (UBM). The Ni-based UBM acts as a w
Flip chip technology with BGA interconnection has attracted a great deal of attention in today’s electronics packaging. One of the challenging issues is the material selection for under bump metallization (UBM). The Ni-based UBM acts as a w
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/75100417482819661854
Autor:
C. S. Huang, 黃建盛
87
In this thesis, the Si-Ge-Ni ternary isotherm at 750 oC was determined by using metallography, electron microanalysis, and x-ray diffraction. The main objective is to provide the necessary thermodynamic information for designing contact mater
In this thesis, the Si-Ge-Ni ternary isotherm at 750 oC was determined by using metallography, electron microanalysis, and x-ray diffraction. The main objective is to provide the necessary thermodynamic information for designing contact mater
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/49995779784769376147