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pro vyhledávání: '"黃昱隆"'
Autor:
Yu-Lung Huang, 黃昱隆
107
In this study, the fabrication of the locking lead has been developed for multi-row quad flat no-lead package (MRQFN) application. The purpose is to enhance the bonding between the lead and the epoxy molding compound (EMC), and to prevent th
In this study, the fabrication of the locking lead has been developed for multi-row quad flat no-lead package (MRQFN) application. The purpose is to enhance the bonding between the lead and the epoxy molding compound (EMC), and to prevent th
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/37pjk5
