Zobrazeno 1 - 2
of 2
pro vyhledávání: '"高子斌"'
Autor:
Kao, Tzu-Pin, 高子斌
102
Chemical mechanical planarization (CMP) process has been widely used in integrated circuit(IC) fabrication, by which the deposit film can be removed through the interactive process of polishing pads, slurries and wafers, and to achieve the d
Chemical mechanical planarization (CMP) process has been widely used in integrated circuit(IC) fabrication, by which the deposit film can be removed through the interactive process of polishing pads, slurries and wafers, and to achieve the d
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/65713468785079864304
Autor:
Zi-Bin Gao, 高子斌
95
In this study, we combine the diffractive optical element（DOE） with the collinear holographic storage system to realize the integrated collinear holographic storage system. We combine the system of the optical pickup head with the colline
In this study, we combine the diffractive optical element（DOE） with the collinear holographic storage system to realize the integrated collinear holographic storage system. We combine the system of the optical pickup head with the colline
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/25690023705060796701