Zobrazeno 1 - 2
of 2
pro vyhledávání: '"陳柏菖"'
Autor:
Po-Chang Chen, 陳柏菖
101
In order to achieve high density, high bandwidth and high transmission, Through-Silicon-Via(TSV) has been widely used in three-dimensional chip integration thus resulting its density is increased. However the quality of signal transmission m
In order to achieve high density, high bandwidth and high transmission, Through-Silicon-Via(TSV) has been widely used in three-dimensional chip integration thus resulting its density is increased. However the quality of signal transmission m
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/10318194651386548166
Autor:
Bo-Chang Chen, 陳柏菖
97
With the development of the next-generation console, the game hardware is becoming more and more important. The motion sensors allow users to experience the virtual reality, and the force feedback devices not only can make games more interest
With the development of the next-generation console, the game hardware is becoming more and more important. The motion sensors allow users to experience the virtual reality, and the force feedback devices not only can make games more interest
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/w6wdym