Zobrazeno 1 - 6
of 6
pro vyhledávání: '"钟 涵"'
Publikováno v:
Chinese Journal of Wildlife / Yesheng Dongwu Xuebao; 2024, Vol. 45 Issue 3, p521-530, 10p
Publikováno v:
Tunnel Construction / Suidao Jianshe (Zhong-Yingwen Ban); 2022 Supplement, Vol. 42, p459-465, 7p
Publikováno v:
Tunnel Construction / Suidao Jianshe (Zhong-Yingwen Ban); Jul2021, Vol. 41 Issue 7, p1225-1233, 9p
Publikováno v:
Tunnel Construction / Suidao Jianshe (Zhong-Yingwen Ban); Mar2020, Vol. 40 Issue 3, p426-434, 9p
Publikováno v:
Tunnel Construction / Suidao Jianshe (Zhong-Yingwen Ban); May2019, Vol. 39 Issue 5, p766-774, 9p
Autor:
Han-Lin Chung, 鐘涵琳
98
The Cu/solder/Ni structure is a common joint configuration used in microelectronic packages today. In the operation of this joint structure at high temperatures, an appreciable amount of Cu can readily diffuse across the entire solder to the
The Cu/solder/Ni structure is a common joint configuration used in microelectronic packages today. In the operation of this joint structure at high temperatures, an appreciable amount of Cu can readily diffuse across the entire solder to the
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/32212520068776655287
