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pro vyhledávání: '"鐘涵琳"'
Autor:
Han-Lin Chung, 鐘涵琳
98
The Cu/solder/Ni structure is a common joint configuration used in microelectronic packages today. In the operation of this joint structure at high temperatures, an appreciable amount of Cu can readily diffuse across the entire solder to the
The Cu/solder/Ni structure is a common joint configuration used in microelectronic packages today. In the operation of this joint structure at high temperatures, an appreciable amount of Cu can readily diffuse across the entire solder to the
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/32212520068776655287
