Zobrazeno 1 - 3
of 3
pro vyhledávání: '"鄭偉祥"'
Autor:
Vincentius Randy Christianto, 鄭偉祥
104
In this era, people use various technologies as their main tools to perform work and support their daily needs and life activities. A lot of new technologies have been developed and shown to the world. The Internet of Things (IoT) is an inno
In this era, people use various technologies as their main tools to perform work and support their daily needs and life activities. A lot of new technologies have been developed and shown to the world. The Internet of Things (IoT) is an inno
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/59457451214007197741
Autor:
Wei-Hsiang Cheng, 鄭偉祥
101
hMMS21 also called Nse2 (non-SMC element 2) is a SUMO E3 ligase. According to the research, MMS21 plays a role in DNA damage repair. Our previous study demonstrated that hMMS21 depletion in MCF7 breast cancer cells reduced E2F1 protein level
hMMS21 also called Nse2 (non-SMC element 2) is a SUMO E3 ligase. According to the research, MMS21 plays a role in DNA damage repair. Our previous study demonstrated that hMMS21 depletion in MCF7 breast cancer cells reduced E2F1 protein level
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/16265403591947728104
Autor:
Wei-Hsiang Cheng, 鄭偉祥
97
Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. Due to the dual actions of chemicals corrosion and abrasive abrasion in the slurry, CMP achieves the effect of global planarizat
Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. Due to the dual actions of chemicals corrosion and abrasive abrasion in the slurry, CMP achieves the effect of global planarizat
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/54196199112206552893