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pro vyhledávání: '"郭昱汝"'
105
The implementation of the copper metallization into semiconductor manufacturing requires a viable pattern definition process – chemical mechanical polishing (CMP) of copper and the diffusion barrier layer. In this study, ruthenium (Ru) has
The implementation of the copper metallization into semiconductor manufacturing requires a viable pattern definition process – chemical mechanical polishing (CMP) of copper and the diffusion barrier layer. In this study, ruthenium (Ru) has
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/k74uj8
Autor:
Kuo, Yu-Ju, 郭昱汝
85
We study the bifurcation scenarios of the von Karman equations with various boundary conditions via numerical continuation methods. First, we investigate the phenomenonof the mode jumping under the Robin boundary conditions.Next, we study sym
We study the bifurcation scenarios of the von Karman equations with various boundary conditions via numerical continuation methods. First, we investigate the phenomenonof the mode jumping under the Robin boundary conditions.Next, we study sym
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/05041453599482327629