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pro vyhledávání: '"趙師杰"'
Autor:
Shih-Chieh Chao, 趙師杰
105
High temperature solders, which are usually applied in chip level packaging, inevitably encounter the Pb-free substitutions in very near future. Among the systems under development, Bi-Ag with the eutectic composition of 2.5wt%Ag and eutecti
High temperature solders, which are usually applied in chip level packaging, inevitably encounter the Pb-free substitutions in very near future. Among the systems under development, Bi-Ag with the eutectic composition of 2.5wt%Ag and eutecti
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/12752415763302682492
