Zobrazeno 1 - 4
of 4
pro vyhledávání: '"謝明雄"'
Autor:
HSIEH,MING-HSIUNG, 謝明雄
106
With compensation, the country expropriates the private properties of the people to promote public use and public interest. People’s basic rights, such as right to life, right to work, property right, freedom of residence and movement, etc
With compensation, the country expropriates the private properties of the people to promote public use and public interest. People’s basic rights, such as right to life, right to work, property right, freedom of residence and movement, etc
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/tf3qxw
Autor:
Ming-Xion Xie, 謝明雄
101
Location-based services(LBS) is very important in the Wireless Sensor Network. In LBS, fingerprint positioning is one of the most commonly used techniques in indoors, because it can be easily established with a low cost. It only takes a few
Location-based services(LBS) is very important in the Wireless Sensor Network. In LBS, fingerprint positioning is one of the most commonly used techniques in indoors, because it can be easily established with a low cost. It only takes a few
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/wn7hz5
Autor:
Ming-Hsiung Hsieh, 謝明雄
99
Taiwan is surrounded by the ocean. Maritime transportation is the lifeline toward Taiwan’s development.With the transition of historical background and technology development, marine vocational schools which have ever been the cradles of tr
Taiwan is surrounded by the ocean. Maritime transportation is the lifeline toward Taiwan’s development.With the transition of historical background and technology development, marine vocational schools which have ever been the cradles of tr
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/44461765887469601523
Autor:
Ming-Hsiung Hsieh, 謝明雄
87
Silicon wafers have been extensively used in the microelectronic and semiconductor industry due to their unique properties and plentiful resources. First part of this work studies the effect of surface damage of test wafer by grinding. The ot
Silicon wafers have been extensively used in the microelectronic and semiconductor industry due to their unique properties and plentiful resources. First part of this work studies the effect of surface damage of test wafer by grinding. The ot
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/56264016631938020341