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The Study of Wire-Bond Defect Analysis in IC Packaging based on Automation Optical Inspection System
Autor:
Yuan-Che Hsu, 許元哲
94
The technology IC packaging covers not only the applications physics, chemistry, machinery, and electrical machinery, but also used various materials like metal, ceramics and so on. In promoting the competitor of IC manufacturing, the use of
The technology IC packaging covers not only the applications physics, chemistry, machinery, and electrical machinery, but also used various materials like metal, ceramics and so on. In promoting the competitor of IC manufacturing, the use of
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/00060634151987627458
