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pro vyhledávání: '"蘇展志"'
Autor:
Su Chan Chih, 蘇展志
99
The application of Die Attach Film (DAF) has greatly improved the quality for IC assembly. It is also a cost effective technology getting more and more interesting in industry. Warpage, delamination and cracking are problems common found duri
The application of Die Attach Film (DAF) has greatly improved the quality for IC assembly. It is also a cost effective technology getting more and more interesting in industry. Warpage, delamination and cracking are problems common found duri
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/69531591899062063764
