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pro vyhledávání: '"莊強名"'
Autor:
Chiang-Ming Chuang, 莊強名
90
Vibration failure can occur in soldering joints of chips through mechanical vibration. In particular, when the vibration frequency meets the resonance, the rate of failure is even higher. However, the current understanding of vibration fatigu
Vibration failure can occur in soldering joints of chips through mechanical vibration. In particular, when the vibration frequency meets the resonance, the rate of failure is even higher. However, the current understanding of vibration fatigu
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/88730256760186135808
