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Because of the rapid increase of power and packaging densities, thermal issues have became important factors of the reliability and performance concerns for advanced very large scale integration (VLSI) design and manufacturing. Therefore, how
Because of the rapid increase of power and packaging densities, thermal issues have became important factors of the reliability and performance concerns for advanced very large scale integration (VLSI) design and manufacturing. Therefore, how
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/79899572271117513450
