Zobrazeno 1 - 2
of 2
pro vyhledávání: '"王朝成"'
Autor:
Chao Cheng Wang, 王朝成
97
In this experiment, the flip-chip technology is used to package the high power LED on the Si submount for solving the poor heat elimination in the traditional method and decreasing the package area by array package. The Micro-electromechanica
In this experiment, the flip-chip technology is used to package the high power LED on the Si submount for solving the poor heat elimination in the traditional method and decreasing the package area by array package. The Micro-electromechanica
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/nj8zpq
Autor:
Chao-Cheng Wang, 王朝成
企業管理學系(EMBA)專班
91
Taking the fire fighters of the Fire Departments and the social public of Taiwan as the targets, this research firstly attempts to understand how the various facets of fire fighters, such as their leadershi
91
Taking the fire fighters of the Fire Departments and the social public of Taiwan as the targets, this research firstly attempts to understand how the various facets of fire fighters, such as their leadershi
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/67924742683227693938