Zobrazeno 1 - 2
of 2
pro vyhledávání: '"王智国"'
Publikováno v:
Metal Working (1674-165X); 2024, Issue 10, p57-60, 4p
Modeling the Viscoelastic Properties of Epoxy Molding Compound during Post Mold Cure in IC Packaging
Autor:
Zhi-Guo Wang, 王智國
94
Epoxy molding compound (EMC) is a common material in electronic packages. Warpage after encapsulating in packaging process is always a problem to engineers. The experimental and simulation results of warpage of EMC-Cu and EMC-Si bi-laminates
Epoxy molding compound (EMC) is a common material in electronic packages. Warpage after encapsulating in packaging process is always a problem to engineers. The experimental and simulation results of warpage of EMC-Cu and EMC-Si bi-laminates
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/40139693337622112337
