Zobrazeno 1 - 5
of 5
pro vyhledávání: '"王子义"'
Publikováno v:
Journal of Chinese Institute of Food Science & Technology / Zhongguo Shipin Xuebao; Sep2022, Vol. 22 Issue 9, p55-62, 8p
Publikováno v:
Journal of Chinese Institute of Food Science & Technology / Zhongguo Shipin Xuebao; Aug2021, Vol. 21 Issue 8, p360-368, 9p
Publikováno v:
Food Research & Development; 2021, Vol. 42 Issue 13, p126-131, 6p
Publikováno v:
China Mechanical Engineering; 10/25/2018, Vol. 29 Issue 20, p2460-2466, 7p
Autor:
Zi-Yi Wang, 王子義
95
Solder joints play an important role for all devices in microelectronic package.In this research,we investigated mechanical properties of pure Sn thin film in micron scale and designed many kinds of micro fabrication processes along with micr
Solder joints play an important role for all devices in microelectronic package.In this research,we investigated mechanical properties of pure Sn thin film in micron scale and designed many kinds of micro fabrication processes along with micr
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/38250048138826888206
